Inventor · disambiguated record
Shin-Puu Jeng
Also filed as: JENG SHIN-PUU
715 granted patents·235 pending applications·16,619 citations·filing 1994–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD714TAIWAN SEMICONDUCTOR MFG86TEXAS INSTRUMENTS INC38APPLIED MATERIALS INC26JENG SHIN-PUU10
Top patents by PatentIndex Score
950 records- 0199US11270975B2Semiconductor packages including passive devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 8, 2022·9 cites·20 claims
- 0299US10658337B2Packages and packaging methods for semiconductor devices, and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 19, 2020·37 cites·20 claims
- 0399US9372206B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 21, 2016·1.8k cites·20 claims
- 0499US8993380B2Structure and method for 3D IC packageTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 31, 2015·900 cites·22 claims
- 0599US8829676B2Interconnect structure for wafer level packageYU CHEN-HUA·Filed 2011·Granted Sep 9, 2014·610 cites·20 claims
- 0699US8802504B13D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 12, 2014·408 cites·20 claims
- 0799US8669174B2Multi-die stacking using bumps with different sizesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 11, 2014·139 cites·20 claims
- 0899US6413583B1Formation of a liquid-like silica layer by reaction of an organosilicon compound and a hydroxyl forming compoundAPPLIED MATERIALS INC·Filed 1999·Granted Jul 2, 2002·725 cites·6 claims
- 0999US6303523B2Plasma processes for depositing low dielectric constant filmsAPPLIED MATERIALS INC·Filed 1998·Granted Oct 16, 2001·751 cites·53 claims
- 1099US6072227ALow power method of depositing a low k dielectric with organo silaneAPPLIED MATERIALS INC·Filed 1998·Granted Jun 6, 2000·541 cites·26 claims
- 1199US6054379AMethod of depositing a low k dielectric with organo silaneAPPLIED MATERIALS INC·Filed 1998·Granted Apr 25, 2000·609 cites·98 claims
- 1298US11942408B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 26, 2024·4 cites·20 claims
- 1398US11791301B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 17, 2023·3 cites·20 claims
- 1498US11749644B2Semiconductor device with curved conductive lines and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 5, 2023·5 cites·20 claims
- 1598US11557559B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 17, 2023·5 cites·20 claims
- 1698US11527474B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·8 cites·20 claims
- 1798US11380666B2Fan-out package with cavity substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·5 cites·20 claims
- 1898US11264359B2Chip bonded to a redistribution structure with curved conductive linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·10 cites·20 claims
- 1998US10741537B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 11, 2020·36 cites·20 claims
- 2098US10663512B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 26, 2020·8 cites·14 claims
- 2198US10332823B2Packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 25, 2019·19 cites·20 claims
- 2298US10175294B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 8, 2019·14 cites·20 claims
- 2398US9780072B23D semiconductor package interposer with die cavityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 3, 2017·25 cites·20 claims
- 2498US9461025B2Electric magnetic shielding structure in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 4, 2016·48 cites·20 claims
- 2598US9299649B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 29, 2016·902 cites·22 claims
- 2698US9128123B2Interposer test structures and methodsLIU TZUAN-HORNG·Filed 2011·Granted Sep 8, 2015·31 cites·20 claims
- 2798US9064879B2Packaging methods and structures using a die attach filmHUNG JUI-PIN·Filed 2011·Granted Jun 23, 2015·836 cites·20 claims
- 2898US9048233B2Package systems having interposersWU WEI-CHENG·Filed 2010·Granted Jun 2, 2015·1.1k cites·19 claims
- 2998US8779599B2Packages including active dies and dummy dies and methods for forming the sameLIN JING-CHENG·Filed 2011·Granted Jul 15, 2014·48 cites·14 claims
- 3098US8519537B23D semiconductor package interposer with die cavityJENG SHIN-PUU·Filed 2010·Granted Aug 27, 2013·81 cites·19 claims
- 3198US8426961B2Embedded 3D interposer structureSHIH YING-CHING·Filed 2010·Granted Apr 23, 2013·188 cites·21 claims
- 3298US8105875B1Approach for bonding dies onto interposersHU HSIEN-PIN·Filed 2010·Granted Jan 31, 2012·192 cites·13 claims
- 3398US6627532B1Method of decreasing the K value in SiOC layer deposited by chemical vapor depositionAPPLIED MATERIALS INC·Filed 2000·Granted Sep 30, 2003·358 cites·27 claims
- 3498US5461003AMultilevel interconnect structure with air gaps formed between metal leadsTEXAS INSTRUMENTS INC·Filed 1994·Granted Oct 24, 1995·427 cites·20 claims
- 3597US11967582B2Multi-chip device and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 23, 2024·2 cites·20 claims
- 3697US11784130B2Structure and formation method of package with underfillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 10, 2023·3 cites·20 claims
- 3797US11756928B2Multi-chip packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·2 cites·20 claims
- 3897US11735572B2Integrated circuit package and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 22, 2023·5 cites·21 claims
- 3997US11637087B2Multi-chip device and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 25, 2023·3 cites·20 claims
- 4097US11610854B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 21, 2023·4 cites·20 claims
- 4197US11393746B2Reinforcing package using reinforcing patchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 19, 2022·4 cites·20 claims
- 4297US11342255B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·4 cites·20 claims
- 4397US10804244B2Semiconductor package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 13, 2020·4 cites·20 claims
- 4497US10784220B2Plurality of semiconductor devices encapsulated by a molding material attached to a redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 22, 2020·17 cites·19 claims
- 4597US10535597B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 14, 2020·16 cites·20 claims
- 4697US10461009B23DIC packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 29, 2019·15 cites·20 claims
- 4797US10157818B2Methods of cooling packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 18, 2018·19 cites·20 claims
- 4897US10062665B2Semiconductor packages with thermal management features for reduced thermal crosstalkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 28, 2018·17 cites·20 claims
- 4997US9985006B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·14 cites·20 claims
- 5097US9935080B2Three-layer Package-on-Package structure and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 3, 2018·15 cites·10 claims
Showing the top 50 of 950 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →