Inventor · disambiguated record
Shin Kim
Also filed as: KIM SHIN · KIM SHIN-DEUK
6 granted patents·3 pending applications·200 citations·filing 1998–2010
84Inventor score
Top patents by PatentIndex Score
9 records- 0195US7868411B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jan 11, 2011·44 cites·2 claims
- 0294US6876074B2Stack package using flexible double wiring substrateSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Apr 5, 2005·131 cites·13 claims
- 0370US8049325B2Integrated circuit devices having printed circuit boards therein with staggered bond fingers that support improved electrical isolationSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Nov 1, 2011·6 cites·14 claims
- 0469US7791195B2Ball grid array (BGA) package and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 7, 2010·4 cites·18 claims
- 0552US6432746B2Method for manufacturing a chip scale package having slits formed on a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Aug 13, 2002·8 cites·20 claims
- 0645US2007096338A1Semiconductor package having non-solder mask defined bonding pads and solder mask defined bonding pads, printed circuit board and semiconductor module having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 0742US2011076829A1Semiconductor Devices and Methods of Forming the SameKIM WOOK-JE·Filed 2010·Application pending·0 cites
- 0837US6183589B1Method for manufacturing lead-on-chip (LOC) semiconductor packages using liquid adhesive applied under the leadsSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Feb 6, 2001·7 cites·18 claims
- 0936US2002119595A1Semiconductor package using tape circuit board with a groove for preventing encapsulant from overflowing and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →