Inventor · disambiguated record
Sho Kumakura
Also filed as: KUMAKURA SHO
30 granted patents·24 pending applications·10 citations·filing 2017–2025
93Inventor score
Files withTOKYO ELECTRON LTD54
Top patents by PatentIndex Score
54 records- 0188US11450537B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Sep 20, 2022·2 cites·22 claims
- 0286US10319613B2Method of selectively etching first region made of silicon nitride against second region made of silicon oxideTOKYO ELECTRON LTD·Filed 2017·Granted Jun 11, 2019·3 cites·13 claims
- 0383US11488836B2Apparatus for substrate processingTOKYO ELECTRON LTD·Filed 2020·Granted Nov 1, 2022·1 cites·19 claims
- 0482US12112954B2Etching method, substrate processing apparatus, and substrate processing systemTOKYO ELECTRON LTD·Filed 2021·Granted Oct 8, 2024·1 cites·20 claims
- 0579US10755944B2Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2018·Granted Aug 25, 2020·2 cites·16 claims
- 0676US10600660B2Method of selectively etching first region made of silicon nitride against second region made of silicon oxideTOKYO ELECTRON LTD·Filed 2019·Granted Mar 24, 2020·1 cites·20 claims
- 0773US11961746B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Apr 16, 2024·0 cites·20 claims
- 0871US2025174466A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0971US2025164886A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1070US12071687B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Aug 27, 2024·0 cites·17 claims
- 1170US2024120187A1Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1269US12308241B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2021·Granted May 20, 2025·0 cites·19 claims
- 1367US12354837B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2023·Granted Jul 8, 2025·0 cites·18 claims
- 1467US11637025B2Apparatus for selectively etching first region made of silicon nitride against second region made of silicon oxideTOKYO ELECTRON LTD·Filed 2020·Granted Apr 25, 2023·0 cites·18 claims
- 1565US11574806B2Film forming methodTOKYO ELECTRON LTD·Filed 2020·Granted Feb 7, 2023·0 cites·11 claims
- 1665US2022301881A1Etching method and etching apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 1764US11380555B2Etching method and etching apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Jul 5, 2022·0 cites·19 claims
- 1863US2025125130A1Control method of substrate processing apparatus including partially etching a workpiece to from a recess in the workpiece and substrate processing systemTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1962US2025349519A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2061US11239090B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2019·Granted Feb 1, 2022·0 cites·18 claims
- 2160US12451361B2Plasma processing method, plasma processing apparatus, and plasma processing systemTOKYO ELECTRON LTD·Filed 2022·Granted Oct 21, 2025·0 cites·26 claims
- 2260US12125710B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Oct 22, 2024·0 cites·17 claims
- 2360US11862441B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Jan 2, 2024·0 cites·18 claims
- 2460US11459655B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2019·Granted Oct 4, 2022·0 cites·17 claims
- 2560US11145518B2Method and apparatus for etching target objectTOKYO ELECTRON LTD·Filed 2019·Granted Oct 12, 2021·0 cites·23 claims
- 2659US12431335B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Sep 30, 2025·0 cites·21 claims
- 2759US2025166976A1Dry-developing resist film formed of metal-containing resistTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2858US2025051915A1Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 2958US2025087455A1Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 3058US2025087454A1Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 3158US2025308926A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 3258US2025279263A1Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 3358US2025314971A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 3457US11139169B2Etching method and etching apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Oct 5, 2021·0 cites·10 claims
- 3557US10777425B2Method of processing substrateTOKYO ELECTRON LTD·Filed 2018·Granted Sep 15, 2020·0 cites·20 claims
- 3657US2024165677A1Method for cleaning chamber or component, substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 3757US2025264805A1Substrate processing method, composition for forming metal-containing resist, metal-containing resist, and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 3857US2024047223A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 3956US11094550B2Etching method and etching apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Aug 17, 2021·0 cites·16 claims
- 4056US2025284198A1Dry development method and dry development apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 4155US10672605B2Film forming methodTOKYO ELECTRON LTD·Filed 2018·Granted Jun 2, 2020·0 cites·19 claims
- 4255US2024128092A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 4354US10483118B2Etching methodTOKYO ELECTRON LTD·Filed 2018·Granted Nov 19, 2019·0 cites·13 claims
- 4454US2025226222A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 4554US2025226223A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 4654US2025224683A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 4753US2025236951A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 4853US2025210328A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 4952US12100578B2Substrate processing methodTOKYO ELECTRON LTD·Filed 2021·Granted Sep 24, 2024·0 cites·14 claims
- 5051US11728166B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Aug 15, 2023·0 cites·22 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →