Inventor · disambiguated record
Shen-Nan Lee
Also filed as: LEE SHEN-NAN
53 granted patents·5 pending applications·157 citations·filing 1998–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD47TAIWAN SEMICONDUCTOR MFG5LEE SHEN-NAN4IND TECH RES INST1LIN KUO-YIN1
Top patents by PatentIndex Score
58 records- 0191US11004794B2Partial barrier free vias for cobalt-based interconnects and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·5 cites·20 claims
- 0291US9236446B2Barc-assisted process for planar recessing or removing of variable-height layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 12, 2016·10 cites·20 claims
- 0389US11495471B2Slurry compositions for chemical mechanical planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 8, 2022·2 cites·20 claims
- 0489US11267987B2Chemical mechanical polishing slurry composition and method of polishing metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 8, 2022·2 cites·20 claims
- 0586US11120995B2Method for forming multi-layer maskTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 14, 2021·3 cites·20 claims
- 0686US10160091B2CMP polishing head design for improving removal rate uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 25, 2018·2 cites·20 claims
- 0786US8153526B2High planarizing method for use in a gate last processLEE SHEN-NAN·Filed 2009·Granted Apr 10, 2012·13 cites·20 claims
- 0885US10847413B2Method of forming contact plugs for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 24, 2020·3 cites·20 claims
- 0985US2025309119A1Partial Barrier Free Vias for Cobalt-Based Interconnects and Methods of Fabrication ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1084US12441912B2Chemical mechanical polishing slurry composition and method of polishing metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
- 1184US11865666B2CMP polishing head design for improving removal rate uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 9, 2024·0 cites·20 claims
- 1282US11529712B2CMP polishing head design for improving removal rate uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 20, 2022·1 cites·17 claims
- 1382US9132523B2Chemical mechanical polish process control for improvement in within-wafer thickness uniformityLEE SHEN-NAN·Filed 2012·Granted Sep 15, 2015·5 cites·20 claims
- 1482US6126838AMethod of wastewater treatment by electrolysis and oxidizationIND TECH RES INST·Filed 1998·Granted Oct 3, 2000·57 cites·13 claims
- 1581US12362281B2Partial barrier free vias for cobalt-based interconnects and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 1681US12176217B2Method for manufacturing a semiconductor using slurryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 1781US11389928B2Method for conditioning polishing padTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 19, 2022·1 cites·20 claims
- 1879US12269141B2Fabrication of a polishing pad for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
- 1979US2025329617A1Contact plugs for semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2077US12431412B2Contact plugs for semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 30, 2025·0 cites·20 claims
- 2177US2025235979A1Fabrication of a polishing pad for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2276US12024651B2Chemical mechanical polishing slurry composition and method of polishing metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
- 2376US9962801B2Systems and methods for performing chemical mechanical planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 8, 2018·3 cites·20 claims
- 2476US2025218792A1Slurry compositions for chemical mechanical planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2575US12261055B2Slurry compositions for chemical mechanical planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 25, 2025·0 cites·20 claims
- 2675US11697183B2Fabrication of a polishing pad for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 11, 2023·0 cites·20 claims
- 2775US9287127B2Wafer back-side polishing system and method for integrated circuit device manufacturing processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 15, 2016·2 cites·20 claims
- 2873US11776910B2Partial barrier free vias for cobalt-based interconnects and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 2973US9852899B2Wafer back-side polishing system and method for integrated circuit device manufacturing processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 26, 2017·1 cites·20 claims
- 3073US6812135B2Adhesion enhancement between CVD dielectric and spin-on low-k silicate filmsTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 2, 2004·15 cites·60 claims
- 3173US6638328B1Bimodal slurry systemTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 28, 2003·14 cites·19 claims
- 3272US10461080B2Method for manufacturing a FinFET deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 29, 2019·1 cites·20 claims
- 3371US11312882B2CMP slurry solution for hardened fluid materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 26, 2022·0 cites·20 claims
- 3471US9559021B2Wafer back-side polishing system and method for integrated circuit device manufacturing processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 31, 2017·1 cites·20 claims
- 3571US8129279B2Chemical mechanical polish process control for improvement in within-wafer thickness uniformityLEE SHEN-NAN·Filed 2008·Granted Mar 6, 2012·4 cites·22 claims
- 3670US9748109B2CMP-friendly coatings for planar recessing or removing of variable-height layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 29, 2017·1 cites·20 claims
- 3769US11688607B2SlurryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 27, 2023·0 cites·19 claims
- 3868US11525072B2Materials and methods for chemical mechanical polishing of ruthenium-containing materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 13, 2022·0 cites·20 claims
- 3967US11756864B2Contact plugs for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 12, 2023·0 cites·20 claims
- 4066US11756825B2Semiconductor structure with oxidized rutheniumTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 12, 2023·0 cites·20 claims
- 4161US11004691B2Mechanism for manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·0 cites·20 claims
- 4261US10727076B2Slurry and manufacturing semiconductor using the slurryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 28, 2020·0 cites·20 claims
- 4360US11031391B2Method for manufacturing a FinFET deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 8, 2021·0 cites·20 claims
- 4459US10497574B2Method for forming multi-layer maskTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 3, 2019·0 cites·20 claims
- 4558US10920105B2Materials and methods for chemical mechanical polishing of ruthenium-containing materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 16, 2021·0 cites·20 claims
- 4657US11011385B2CMP-friendly coatings for planar recessing or removing of variable-height layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 18, 2021·0 cites·20 claims
- 4757US10774241B2CMP slurry solution for hardened fluid materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 15, 2020·0 cites·20 claims
- 4856US10510555B2Mechanism for manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
- 4956US10144109B2Polisher, polishing tool, and polishing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 4, 2018·0 cites·20 claims
- 5055US6924238B2Edge peeling improvement of low-k dielectric materials stack by adjusting EBR resistanceTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Aug 2, 2005·5 cites·20 claims
Showing the top 50 of 58 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →