Inventor · disambiguated record
Sheng-Yuan Lee
Also filed as: LEE SHENG Y · LEE SHENG-YUAN
78 granted patents·10 pending applications·602 citations·filing 1981–2025
99Inventor score
Top patents by PatentIndex Score
88 records- 0195US7317354B2InductorVIA TECH INC·Filed 2006·Granted Jan 8, 2008·40 cites·20 claims
- 0295US7202548B2Embedded capacitor with interdigitated structureVIA TECH INC·Filed 2005·Granted Apr 10, 2007·38 cites·22 claims
- 0393US7382219B1Inductor structureVIA TECH INC·Filed 2007·Granted Jun 3, 2008·25 cites·18 claims
- 0493US7312685B1Symmetrical inductorVIA TECH INC·Filed 2007·Granted Dec 25, 2007·23 cites·20 claims
- 0591US7339452B2Embedded inductor and application thereofVIA TECH INC·Filed 2006·Granted Mar 4, 2008·20 cites·15 claims
- 0690US9443843B2Integrated circuit deviceVIA TECH INC·Filed 2015·Granted Sep 13, 2016·8 cites·20 claims
- 0790US8253523B2Spiral inductor deviceLEE SHENG-YUAN·Filed 2011·Granted Aug 28, 2012·9 cites·20 claims
- 0890US7705704B2Inductor structureVIA TECH INC·Filed 2008·Granted Apr 27, 2010·21 cites·16 claims
- 0989US7626480B2Spiral inductor with multi-trace structureVIA TECH INC·Filed 2007·Granted Dec 1, 2009·14 cites·13 claims
- 1089US7598836B2Multilayer winding inductorVIA TECH INC·Filed 2006·Granted Oct 6, 2009·19 cites·20 claims
- 1189US7420452B1Inductor structureVIA TECH INC·Filed 2007·Granted Sep 2, 2008·19 cites·18 claims
- 1286US8552308B2Differential signal pair transmission structure, wiring board and electronic moduleLEE SHENG-YUAN·Filed 2011·Granted Oct 8, 2013·7 cites·20 claims
- 1385US8083546B2Electric connector and electric assemblyLEE SHENG-YUAN·Filed 2010·Granted Dec 27, 2011·16 cites·14 claims
- 1485US7633368B2On-chip inductorVIA TECH INC·Filed 2007·Granted Dec 15, 2009·13 cites·12 claims
- 1584US10468830B2Paddle card and plug-cable assemblyVIA TECH INC·Filed 2016·Granted Nov 5, 2019·4 cites·30 claims
- 1684US7443272B2Signal transmission structure, circuit board and connector assembly structureVIA TECH INC·Filed 2005·Granted Oct 28, 2008·13 cites·14 claims
- 1781US8081056B2Spiral inductorLEE SHENG-YUAN·Filed 2008·Granted Dec 20, 2011·11 cites·20 claims
- 1881US7312683B1Symmetrical inductorVIA TECH INC·Filed 2007·Granted Dec 25, 2007·10 cites·19 claims
- 1980US7663463B2Inductor structureVIA TECH INC·Filed 2007·Granted Feb 16, 2010·10 cites·20 claims
- 2079US12107043B2Multilayer-type on-chip inductor structureVIA LABS INC·Filed 2023·Granted Oct 1, 2024·0 cites·10 claims
- 2179US7504923B1Inductor structureVIA TECH INC·Filed 2007·Granted Mar 17, 2009·9 cites·20 claims
- 2279US7489218B2Inductor structureVIA TECH INC·Filed 2007·Granted Feb 10, 2009·7 cites·16 claims
- 2378US9443842B2Integrated circuit deviceVIA TECH INC·Filed 2015·Granted Sep 13, 2016·3 cites·20 claims
- 2478US7504922B2Embedded inductor element and chip package applying the sameVIA TECH INC·Filed 2006·Granted Mar 17, 2009·8 cites·10 claims
- 2578US7129568B2Chip package and electrical connection structure between chip and substrateVIA TECH INC·Filed 2004·Granted Oct 31, 2006·25 cites·16 claims
- 2678US7087993B2Chip package and electrical connection structure between chip and substrateVIA TECH INC·Filed 2004·Granted Aug 8, 2006·25 cites·22 claims
- 2777US9210800B1Circuit layout structure, circuit board and electronic assemblyVIA TECH INC·Filed 2014·Granted Dec 8, 2015·3 cites·21 claims
- 2877US7215226B2Skew-symmetrical defected ground structure for parallel-coupled line filtersVIA TECH INC·Filed 2005·Granted May 8, 2007·6 cites·20 claims
- 2976US9991327B2Semiconductor device having inductorVIA TECH INC·Filed 2017·Granted Jun 5, 2018·2 cites·10 claims
- 3074US7671282B2Structure of a circuit board for improving the performance of routing tracesVIA TECH INC·Filed 2004·Granted Mar 2, 2010·16 cites·12 claims
- 3174US7274271B2Signal transmission structure having alignment hole for coaxial cable connectorVIA TECH INC·Filed 2005·Granted Sep 25, 2007·5 cites·14 claims
- 3272US11605590B2Multilayer-type on-chip inductor structureVIA LABS INC·Filed 2021·Granted Mar 14, 2023·0 cites·8 claims
- 3372US10218127B2Paddle card and plug-cable assemblyVIA TECH INC·Filed 2017·Granted Feb 26, 2019·3 cites·24 claims
- 3472US8022805B2Spiral inductor deviceVIA TECH INC·Filed 2008·Granted Sep 20, 2011·5 cites·18 claims
- 3572US7420451B2Symmetrical differential inductorVIA TECH INC·Filed 2007·Granted Sep 2, 2008·5 cites·20 claims
- 3671US12354947B2Multilayer-type on-chip inductor structureVIA LABS INC·Filed 2021·Granted Jul 8, 2025·0 cites·20 claims
- 3771US8303315B2Electrical connector and electronic assembly having a lead arrangementLEE SHENG-YUAN·Filed 2009·Granted Nov 6, 2012·11 cites·15 claims
- 3871US7247937B2Mounting pad structure for wire-bonding type lead frame packagesVIA TECH INC·Filed 2005·Granted Jul 24, 2007·6 cites·20 claims
- 3969US9444165B2Pin arrangement and electronic assemblyVIA TECH INC·Filed 2014·Granted Sep 13, 2016·1 cites·18 claims
- 4069US8476747B2Leadframe, leadframe type package and lead laneLEE SHENG-YUAN·Filed 2011·Granted Jul 2, 2013·2 cites·20 claims
- 4168US7709745B2Circuit board with plating barVIA TECH INC·Filed 2006·Granted May 4, 2010·3 cites·18 claims
- 4268US7477125B1Symmetrical inductor deviceVIA TECH INC·Filed 2008·Granted Jan 13, 2009·4 cites·15 claims
- 4367US8740651B2Lead arrangement, electric connector and electric assemblyLEE SHENG-YUAN·Filed 2012·Granted Jun 3, 2014·5 cites·21 claims
- 4466US12284815B2Multilayer-type on-chip inductor structureVIA LABS INC·Filed 2022·Granted Apr 22, 2025·0 cites·10 claims
- 4566US7642890B2Inductor structureVIA TECH INC·Filed 2007·Granted Jan 5, 2010·3 cites·12 claims
- 4666US7030490B2Structure of multi-tier wire bonding for high frequency integrated circuitVIA TECH INC·Filed 2004·Granted Apr 18, 2006·13 cites·34 claims
- 4765US7436268B2Signal transmission structure, circuit board and connector assembly structureVIA TECH INC·Filed 2005·Granted Oct 14, 2008·3 cites·20 claims
- 4865US5343525AHard disk data security deviceVALUE TECHNOLOGY INC·Filed 1992·Granted Aug 30, 1994·51 cites·7 claims
- 4965US2025151296A1Multilayer-type on-chip inductor structureVIA LABS INC·Filed 2025·Application pending·0 cites
- 5064US8084848B2Leadframe, leadframe type package and lead laneLEE SHENG-YUAN·Filed 2009·Granted Dec 27, 2011·2 cites·23 claims
Showing the top 50 of 88 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →