Inventor · disambiguated record
Shidong Li
Also filed as: LI SHIDONG
59 granted patents·7 pending applications·161 citations·filing 2002–2024
98Inventor score
Files withIBM52Qingdao haier refrigerator co ltd3GLOBALFOUNDRIES INC2LI SHIDONG2DONG E E JIAO CO LTD1
Top patents by PatentIndex Score
66 records- 0197US11191155B1Tamper-respondent assembly with structural material within sealed inner compartmentIBM·Filed 2020·Granted Nov 30, 2021·16 cites·20 claims
- 0297US9466538B1Method to achieve ultra-high chip-to-chip alignment accuracy for wafer-to-wafer bonding processGLOBALFOUNDRIES INC·Filed 2015·Granted Oct 11, 2016·43 cites·17 claims
- 0395US9666539B1Packaging for high speed chip to chip communicationIBM·Filed 2015·Granted May 30, 2017·12 cites·18 claims
- 0495US9089052B2Multichip module with stiffening frame and associated coversIBM·Filed 2014·Granted Jul 21, 2015·17 cites·8 claims
- 0593US10566313B1Integrated circuit chip carrier with in-plane thermal conductance layerIBM·Filed 2018·Granted Feb 18, 2020·8 cites·20 claims
- 0692US9443799B2Interposer with lattice construction and embedded conductive metal structuresIBM·Filed 2014·Granted Sep 13, 2016·9 cites·8 claims
- 0791US10056268B2Limiting electronic package warpageIBM·Filed 2017·Granted Aug 21, 2018·7 cites·14 claims
- 0888US9673064B2Interposer with lattice construction and embedded conductive metal structuresIBM·Filed 2015·Granted Jun 6, 2017·4 cites·16 claims
- 0985US9089051B2Multichip module with stiffening frame and associated coversIBM·Filed 2013·Granted Jul 21, 2015·6 cites·12 claims
- 1083US11527462B2Circuit substrate with mixed pitch wiringIBM·Filed 2019·Granted Dec 13, 2022·3 cites·11 claims
- 1182US11302651B2Laminated stiffener to control the warpage of electronic chip carriersIBM·Filed 2019·Granted Apr 12, 2022·2 cites·19 claims
- 1282US9543255B2Reduced-warpage laminate structureIBM·Filed 2016·Granted Jan 10, 2017·3 cites·1 claims
- 1380US9093563B2Electronic module assembly with patterned adhesive arrayIBM·Filed 2013·Granted Jul 28, 2015·4 cites·21 claims
- 1479US11098946B2Door-in-door having display screen assembly and refrigerator having the sameHAIER SMART HOME CO LTD·Filed 2019·Granted Aug 24, 2021·4 cites·6 claims
- 1579US9953935B2Packaging for high speed chip to chip communicationIBM·Filed 2017·Granted Apr 24, 2018·2 cites·15 claims
- 1676US10804181B2Heterogeneous thermal interface material for corner and or edge degradation mitigationIBM·Filed 2019·Granted Oct 13, 2020·2 cites·7 claims
- 1773US10607928B1Reduction of laminate failure in integrated circuit (IC) device carrierIBM·Filed 2019·Granted Mar 31, 2020·1 cites·20 claims
- 1873US10593564B2Lid attach optimization to limit electronic package warpageIBM·Filed 2018·Granted Mar 17, 2020·1 cites·6 claims
- 1973US9613915B2Reduced-warpage laminate structureIBM·Filed 2014·Granted Apr 4, 2017·2 cites·16 claims
- 2072US10083886B2Lid attach optimization to limit electronic package warpageIBM·Filed 2017·Granted Sep 25, 2018·1 cites·7 claims
- 2171US11410894B2Polygon integrated circuit (IC) packagingIBM·Filed 2019·Granted Aug 9, 2022·1 cites·8 claims
- 2271US10460956B2Interposer with lattice construction and embedded conductive metal structuresIBM·Filed 2016·Granted Oct 29, 2019·1 cites·17 claims
- 2371US10083919B2Packaging for high speed chip to chip communicationIBM·Filed 2017·Granted Sep 25, 2018·1 cites·1 claims
- 2469US11569181B2Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafersIBM·Filed 2020·Granted Jan 31, 2023·0 cites·11 claims
- 2567US12052825B2Flexible circuit structure for circuit line bendingIBM·Filed 2021·Granted Jul 30, 2024·0 cites·15 claims
- 2667US10049896B2Lid attach optimization to limit electronic package warpageIBM·Filed 2015·Granted Aug 14, 2018·1 cites·3 claims
- 2764US11756930B2High bandwidth moduleIBM·Filed 2021·Granted Sep 12, 2023·0 cites·11 claims
- 2864US9892935B2Limiting electronic package warpage with semiconductor chip lid and lid-ringIBM·Filed 2015·Granted Feb 13, 2018·1 cites·20 claims
- 2963US8940550B1Maintaining laminate flatness using magnetic retention during chip joiningIBM·Filed 2013·Granted Jan 27, 2015·1 cites·19 claims
- 3062US11201136B2High bandwidth moduleIBM·Filed 2020·Granted Dec 14, 2021·0 cites·14 claims
- 3162US2025349798A1Multiple chip module with integrated microchannel coolingIBM·Filed 2024·Application pending·0 cites
- 3261US11453826B2Liquid crystal alignment agent, liquid crystal alignment film and liquid crystal display elementJIANGSU SUNERA TECH CO LTD·Filed 2022·Granted Sep 27, 2022·0 cites·8 claims
- 3361US9818682B2Laminate substrates having radial cut metallic planesIBM·Filed 2014·Granted Nov 14, 2017·1 cites·19 claims
- 3460US11887908B2Electronic package structure with offset stacked chips and top and bottom side cooling lidIBM·Filed 2021·Granted Jan 30, 2024·0 cites·20 claims
- 3560US10892233B2Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafersIBM·Filed 2018·Granted Jan 12, 2021·0 cites·7 claims
- 3660US10636746B2Method of forming an electronic packageIBM·Filed 2018·Granted Apr 28, 2020·0 cites·12 claims
- 3758US2020135701A1Integrated Circuit Chip Carrier with In-Plane Thermal Conductance LayerIBM·Filed 2020·Application pending·0 cites
- 3857US2024347497A1Thermal solutions for advanced semiconductorsIBM·Filed 2023·Application pending·0 cites
- 3956US11784160B2Asymmetric die bondingIBM·Filed 2020·Granted Oct 10, 2023·0 cites·20 claims
- 4056US10332813B2Lid attach optimization to limit electronic package warpageIBM·Filed 2017·Granted Jun 25, 2019·0 cites·11 claims
- 4156US9293439B2Electronic module assembly with patterned adhesive arrayGLOBALFOUNDRIES INC·Filed 2014·Granted Mar 22, 2016·0 cites·7 claims
- 4255US10685919B2Reduced-warpage laminate structureIBM·Filed 2017·Granted Jun 16, 2020·0 cites·9 claims
- 4354US11430710B2Lid/heat spreader having targeted flexibilityIBM·Filed 2020·Granted Aug 30, 2022·0 cites·20 claims
- 4453US11694992B2Near tier decoupling capacitorsIBM·Filed 2021·Granted Jul 4, 2023·0 cites·14 claims
- 4553US11121096B2Active control of electronic package warpageIBM·Filed 2019·Granted Sep 14, 2021·0 cites·15 claims
- 4653US10249548B2Test cell for laminate and methodIBM·Filed 2017·Granted Apr 2, 2019·0 cites·20 claims
- 4753US9947603B2Lid attach optimization to limit electronic package warpageIBM·Filed 2015·Granted Apr 17, 2018·0 cites·6 claims
- 4853US7446728B2Method and apparatus for constructing general wireless antenna systemsLI SHIDONG·Filed 2007·Granted Nov 4, 2008·3 cites·19 claims
- 4952US11448450B2Refrigerator and control method thereofQingdao haier refrigerator co ltd·Filed 2019·Granted Sep 20, 2022·0 cites·10 claims
- 5052US11304378B2Aquatic weed planting plate for aquariumUNIV GUILIN TECHNOLOGY·Filed 2020·Granted Apr 19, 2022·0 cites·9 claims
Showing the top 50 of 66 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →