Inventor · disambiguated record
Sheng Li
Also filed as: LI SHENG · LI SHENG C · LI Sheng-chun
36 granted patents·17 pending applications·73 citations·filing 2008–2025
96Inventor score
Top patents by PatentIndex Score
53 records- 0195US10234930B2Performing power management in a multicore processorINTEL CORP·Filed 2015·Granted Mar 19, 2019·20 cites·24 claims
- 0293US11676891B2Method to enable 30 microns pitch EMIB or belowINTEL CORP·Filed 2021·Granted Jun 13, 2023·2 cites·20 claims
- 0390US10020262B2High resolution solder resist material for silicon bridge applicationINTEL CORP·Filed 2016·Granted Jul 10, 2018·7 cites·18 claims
- 0488US9910481B2Performing power management in a multicore processorINTEL CORP·Filed 2015·Granted Mar 6, 2018·7 cites·22 claims
- 0586US11088062B2Method to enable 30 microns pitch EMIB or belowINTEL CORP·Filed 2017·Granted Aug 10, 2021·4 cites·14 claims
- 0686US2024332203A1Microelectronic device with embedded die substrate on interposerINTEL CORP·Filed 2024·Application pending·0 cites
- 0785US10664199B2Application driven hardware cache managementINTEL CORP·Filed 2018·Granted May 26, 2020·3 cites·20 claims
- 0884US11430740B2Microelectronic device with embedded die substrate on interposerINTEL CORP·Filed 2017·Granted Aug 30, 2022·2 cites·13 claims
- 0984US9953959B1Metal protected fan-out cavityINTEL CORP·Filed 2017·Granted Apr 24, 2018·4 cites·8 claims
- 1083US9690716B2High performance persistent memory for region-centric consistent and atomic updatesINTEL CORP·Filed 2015·Granted Jun 27, 2017·4 cites·24 claims
- 1181US9430396B2Updating persistent data in persistent memory-based storageINTEL CORP·Filed 2014·Granted Aug 30, 2016·5 cites·23 claims
- 1280US11894311B2Microelectronic device with embedded die substrate on interposerINTEL CORP·Filed 2022·Granted Feb 6, 2024·0 cites·19 claims
- 1378US12046560B2Microelectronic device with embedded die substrate on interposerINTEL CORP·Filed 2021·Granted Jul 23, 2024·0 cites·19 claims
- 1477US11581271B2Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrateINTEL CORP·Filed 2019·Granted Feb 14, 2023·2 cites·27 claims
- 1577US11251113B2Methods of embedding magnetic structures in substratesINTEL CORP·Filed 2017·Granted Feb 15, 2022·2 cites·16 claims
- 1676US12230563B2Method to enable 30 microns pitch EMIB or belowINTEL CORP·Filed 2022·Granted Feb 18, 2025·0 cites·21 claims
- 1775US10716372B1Umbrella frame bending structure for two-fold inverted umbrellaLI SHENG CHUN·Filed 2019·Granted Jul 21, 2020·5 cites·3 claims
- 1875US2025149433A1New method to enable 30 microns pitch emib or belowINTEL CORP·Filed 2025·Application pending·0 cites
- 1972US10775873B2Performing power management in a multicore processorINTEL CORP·Filed 2019·Granted Sep 15, 2020·1 cites·19 claims
- 2070US11862552B2Methods of embedding magnetic structures in substratesINTEL CORP·Filed 2022·Granted Jan 2, 2024·0 cites·7 claims
- 2170US11335632B2Magnetic inductor structures for package devicesINTEL CORP·Filed 2017·Granted May 17, 2022·1 cites·15 claims
- 2264US10575610B1Two-stage folding structure for two-fold inverted umbrellaLI SHENG CHUN·Filed 2019·Granted Mar 3, 2020·2 cites·6 claims
- 2364US2022230951A1Magnetic inductor structures for package devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 2460US11651885B2Magnetic core inductorsINTEL CORP·Filed 2017·Granted May 16, 2023·0 cites·11 claims
- 2559US8399264B2Alignment inspectionZOU ZHIHUA·Filed 2010·Granted Mar 19, 2013·2 cites·14 claims
- 2659US2025210491A1Vertically embedded utility patch for semiconductor packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 2757US2024421043A1Substrate process flow for enabling substrate to die hybrid bondingINTEL CORP·Filed 2023·Application pending·0 cites
- 2856US2025201732A1Microelectronic assemblies with crack-healing materials for glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 2956US2025273607A1Methods and architectures for shallow fiducial and metal defined pad designsINTEL CORP·Filed 2024·Application pending·0 cites
- 3055US10108556B2Updating persistent data in persistent memory-based storageINTEL CORP·Filed 2016·Granted Oct 23, 2018·0 cites·22 claims
- 3155US2024332195A1Spray-coated photoresist and photoimageable dielectrics to enable tsv bridge for glass core packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 3255US2025266345A1Methods and apparatus to reduce discoloration of solder resists in immersion cooling environmentsINTEL CORP·Filed 2025·Application pending·0 cites
- 3354US2024079337A1Microelectronic assemblies having power delivery routed through a bridge dieINTEL CORP·Filed 2022·Application pending·0 cites
- 3454US2025309148A1Substrate with component embedded in a blind cavityINTEL CORP·Filed 2024·Application pending·0 cites
- 3553US9820386B2Plasma etching of solder resist openingsINTEL CORP·Filed 2016·Granted Nov 14, 2017·0 cites·14 claims
- 3652US11824013B2Package substrate with reduced interconnect stressINTEL CORP·Filed 2019·Granted Nov 21, 2023·0 cites·20 claims
- 3752US2025344841A1Mechanism for an extension leafKING FURNITURE AUSTRALIA PTY LTD·Filed 2025·Application pending·0 cites
- 3851US10672859B2Embedded magnetic inductorINTEL CORP·Filed 2018·Granted Jun 2, 2020·0 cites·12 claims
- 3951US10126985B2Application driven hardware cache managementINTEL CORP·Filed 2015·Granted Nov 13, 2018·0 cites·16 claims
- 4051US2025112175A1Microelectronic assemblies with edge stress reduction in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 4150US10692965B23D conductive ink printing method and inductor formed thereofINTEL CORP·Filed 2018·Granted Jun 23, 2020·0 cites·11 claims
- 4249US11622448B2Sandwich-molded cores for high-inductance architecturesINTEL CORP·Filed 2019·Granted Apr 4, 2023·0 cites·25 claims
- 4349US11196165B2Low z-height, ultra-low dielectric constant air cavity based and multi-core/highly asymmetric antenna substrate architectures for electrical performance improvements in 5G mm-wave applicationsINTEL CORP·Filed 2018·Granted Dec 7, 2021·0 cites·25 claims
- 4448US2009321932A1Coreless substrate package with symmetric external dielectric layersGONZALEZ JAVIER SOTO·Filed 2008·Application pending·0 cites
- 4547US10660415B1Umbrella frame structure for two-fold inverted umbrellaLI SHENG CHUN·Filed 2019·Granted May 26, 2020·0 cites·3 claims
- 4647US10617185B2Umbrella with umbrella cloth connected using retaining blocksLI SHENG CHUN·Filed 2019·Granted Apr 14, 2020·0 cites·2 claims
- 4747US2022310518A1Embedded bridge architecture with thinned surfaceINTEL CORP·Filed 2021·Application pending·0 cites
- 4847US2019231040A1Air filter umbrellaLI SHENG CHUN·Filed 2018·Application pending·0 cites
- 4946US12336197B2In-plane inductors in IC packagesINTEL CORP·Filed 2020·Granted Jun 17, 2025·0 cites·19 claims
- 5046US11610706B2Release layer-assisted selective embedding of magnetic material in cored and coreless organic substratesINTEL CORP·Filed 2018·Granted Mar 21, 2023·0 cites·12 claims
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →