Inventor · disambiguated record
Shih-Che Lin
Also filed as: LIN SHIH-CHE · LIN SHIH-CHE JEFF
25 granted patents·16 pending applications·14 citations·filing 2001–2025
92Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD32APPLIED MATERIALS INC1AU OPTRONICS CORP1AUO CORP1CHUNG SHAN INST OF SCIENCE1
Top patents by PatentIndex Score
41 records- 0196US11532561B2Different via configurations for different via interface requirementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·3 cites·20 claims
- 0293US12057392B2Conductive features having varying resistanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 6, 2024·2 cites·20 claims
- 0389US12266703B2Dielectric structures for semiconductor device structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 1, 2025·1 cites·20 claims
- 0487US2025359137A1Disposable Hard Mask for Interconnect FormationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0584US12278188B2Different via configurations for different via interface requirementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 0683US2025239527A1Different Via Configurations for Different Via Interface RequirementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0782US11227830B2Conductive features having varying resistanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 18, 2022·2 cites·20 claims
- 0881US2025366046A1Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0979US12142565B2Different via configurations for different via interface requirementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 1079US2025364493A1Semiconductor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1179US2024387660A1Disposable Hard Mask for Interconnect FormationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1277US2024355730A1Conductive features having varying resistanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1375US2024387626A1Semiconductor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1474US11107896B2Vertical interconnect features and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 31, 2021·1 cites·20 claims
- 1574US2024387663A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1674US2024379432A1Contact formation method and related structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1773US2024371955A1Contact structure with silicide and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1871US2025070085A1Semiconductor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1969US9666495B2Method for reducing core-to-core mismatches in SOC applicationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 30, 2017·2 cites·20 claims
- 2068US12464774B2Semiconductor structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 4, 2025·0 cites·20 claims
- 2168US12080769B2Contact structure with silicide and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
- 2267US12439678B2Isolation structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 7, 2025·0 cites·20 claims
- 2367US12324202B2Semiconductor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 3, 2025·0 cites·20 claims
- 2467US2022359675A1Source/Drain Via Having Reduced ResistanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2566US12199157B2Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·20 claims
- 2666US12074063B2Contact formation method and related structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 27, 2024·0 cites·20 claims
- 2765US11855154B2Vertical interconnect features and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 2865US11508822B2Source/drain via having reduced resistanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
- 2962US2025192125A1Display panelAUO CORP·Filed 2024·Application pending·0 cites
- 3060US2025324560A1Semiconductor device structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3157US9837401B2Semiconductor devices, transistors, and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 5, 2017·0 cites·18 claims
- 3254US11177212B2Contact formation method and related structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 16, 2021·0 cites·20 claims
- 3353US11435658B2Projection module, imaging module, and electronic deviceTRIPLE WIN TECH SHENZHEN CO LTD·Filed 2021·Granted Sep 6, 2022·0 cites·12 claims
- 3453US11408586B1Display deviceAU OPTRONICS CORP·Filed 2022·Granted Aug 9, 2022·0 cites·24 claims
- 3551US10002802B2Method for reducing core-to-core mismatches in SOC applicationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 19, 2018·0 cites·20 claims
- 3645US8883583B2Semiconductor devices, transistors, and methods of manufacture thereofHUANG CHING-KUN·Filed 2012·Granted Nov 11, 2014·0 cites·19 claims
- 3744US10324517B2FPGA-based system power estimation apparatus and methodIND TECH RES INST·Filed 2016·Granted Jun 18, 2019·0 cites·32 claims
- 3837US7421019B2Hierarchical adaptive equalizer and design method thereofCHUNG SHAN INST OF SCIENCE·Filed 2004·Granted Sep 2, 2008·3 cites·23 claims
- 3934US6718495B2CGROM testing deviceWINTEK CORP·Filed 2001·Granted Apr 6, 2004·0 cites·4 claims
- 4033US2003045081A1MOSFET having a stacked silicon structure and methodAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 4131US2003124873A1Method of annealing an oxide filmFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →