Inventor · disambiguated record
Sheng Liu
Also filed as: LIU SHENG · LIU SHENG-JANG
9 granted patents·2 pending applications·70 citations·filing 2002–2024
86Inventor score
Top patents by PatentIndex Score
11 records- 0197US9874526B2Methods and apparatus for polarized wafer inspectionKLA TENCOR CORP·Filed 2017·Granted Jan 23, 2018·17 cites·22 claims
- 0295US9194811B1Apparatus and methods for improving defect detection sensitivityKLA TENCOR CORP·Filed 2014·Granted Nov 24, 2015·23 cites·21 claims
- 0394US10634487B2Method and system for optical three dimensional topography measurementKLA TENCOR CORP·Filed 2016·Granted Apr 28, 2020·11 cites·10 claims
- 0494US10228331B2Methods and apparatus for polarized wafer inspectionKLA TENCOR CORP·Filed 2017·Granted Mar 12, 2019·6 cites·17 claims
- 0583US10739275B2Simultaneous multi-directional laser wafer inspectionKLA TENCOR CORP·Filed 2017·Granted Aug 11, 2020·3 cites·22 claims
- 0672US2024379398A1Semiconductor processing tool and method of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0764US11287248B2Method and system for optical three dimensional topography measurementKLA TENCOR CORP·Filed 2020·Granted Mar 29, 2022·0 cites·9 claims
- 0861US2023143537A1Semiconductor processing tool and method of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 0955US12195875B2Laser processing system integrated with MBE deviceUNIV WUHAN·Filed 2024·Granted Jan 14, 2025·0 cites·6 claims
- 1055US11366069B2Simultaneous multi-directional laser wafer inspectionKLA TENCOR CORP·Filed 2020·Granted Jun 21, 2022·0 cites·20 claims
- 1154US6698105B2Tool and method for measuring depth of countersunk portion of a holeHON HAI PREC IND CO LTD·Filed 2002·Granted Mar 2, 2004·10 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →