Inventor · disambiguated record

Shicai Ma

Also filed as: MA SHICAI

1 granted patent·1 pending application·6 citations·filing 2010–2012

30Inventor score

Technology areasH10W

Files withCHIEN JACK CHANG2

Top patents by PatentIndex Score

2 records

0173US8499813B2System for separating a diced semiconductor die from a die attach tapeCHIEN JACK CHANG·Filed 2012·Granted Aug 6, 2013·6 cites·20 claims
0233US2011084377A1System for separating a diced semiconductor die from a die attach tapeCHIEN JACK CHANG·Filed 2010·Application pending·0 cites

Join the waitlist — get patent alerts

Get an alert when Shicai Ma files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →