Inventor · disambiguated record
Shigeki Maekawa
Also filed as: MAEKAWA SHIGEKI
20 granted patents·1 pending application·440 citations·filing 1990–2006
96Inventor score
Files withMITSUBISHI ELECTRIC CORP18MATSUSHITA ELECTRIC INDUSTRIAL CO LTD1MISUBISHI DENKI KABUSHIKI KAIS1MITSUBISHI DENKI KABSUHIKI KAI1
Top patents by PatentIndex Score
21 records- 0194US6741086B2Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatusMITSUBISHI ELECTRIC CORP·Filed 2002·Granted May 25, 2004·50 cites·15 claims
- 0291US5433262AMethod for manufacturing casting and apparatus for manufacturing a castingMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Jul 18, 1995·30 cites·24 claims
- 0389US6633176B2Semiconductor device test probe having improved tip portion and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Oct 14, 2003·47 cites·7 claims
- 0489US6344753B1Test socket having improved contact terminals, and method of forming contact terminals of the test socketMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Feb 5, 2002·64 cites·8 claims
- 0587US6794890B1Test socket, method of manufacturing the test socket, test method using the test socket, and member to be testedMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 21, 2004·48 cites·5 claims
- 0686US7276923B2Semiconductor device test probeMITSUBISHI ELECTRIC CORP·Filed 2005·Granted Oct 2, 2007·12 cites·4 claims
- 0783US6646455B2Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matterMITSUBISHI DENKI KABSUHIKI KAI·Filed 1998·Granted Nov 11, 2003·52 cites·14 claims
- 0882US7274195B2Semiconductor device test probeMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Sep 25, 2007·26 cites·4 claims
- 0982US6888344B2Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matterMITSUBISHI ELECTRIC CORP·Filed 2002·Granted May 3, 2005·24 cites·5 claims
- 1074US6989681B2Socket for testing a semiconductor device and a connecting sheet used for the sameMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Jan 24, 2006·15 cites·12 claims
- 1173US5067550AManufacturing method for defect-free casting productMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Nov 26, 1991·13 cites·26 claims
- 1268US6882069B1Vehicle AC generator with rectifier diode package disposed between cooling platesMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Apr 19, 2005·16 cites·17 claims
- 1361US6628127B2Probe card for testing semiconductor integrated circuit and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 30, 2003·9 cites·12 claims
- 1460US7785406B2Apparatus for volatile organic compound treatment and method of volatile organic compound treatmentMITSUBISHI ELECTRIC CORP·Filed 2006·Granted Aug 31, 2010·1 cites·16 claims
- 1559US6885204B2Probe card, and testing apparatus having the sameMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Apr 26, 2005·7 cites·2 claims
- 1656US6667626B2Probe card, and testing apparatus having the sameMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Dec 23, 2003·6 cites·4 claims
- 1754US7534979B2Pressure-contact type rectifier with contact friction reducerMITSUBISHI ELECTRIC CORP·Filed 2004·Granted May 19, 2009·7 cites·4 claims
- 1848US7112976B2Test socket, method of manufacturing the test socket, test method using the test socket, and member to be testedMISUBISHI DENKI KABUSHIKI KAIS·Filed 2004·Granted Sep 26, 2006·3 cites·8 claims
- 1942US2005145842A1Socket for testing a semiconductor device and a connecting sheet used for the sameMITSUBISHI ELECTRIC CORP·Filed 2005·Application pending·0 cites
- 2038US5672285ALaser casting apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Sep 30, 1997·7 cites·20 claims
- 2133US5972069AMetallic material made from tungsten or molybdenum, method of producing the metallic material, and secondary product material using the metallic materialMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Oct 26, 1999·3 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when Shigeki Maekawa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →