Inventor · disambiguated record
Shinya Morikita
Also filed as: MORIKITA SHINYA
24 granted patents·10 pending applications·9 citations·filing 2005–2025
90Inventor score
Files withTOKYO ELECTRON LTD34
Top patents by PatentIndex Score
34 records- 0187US11251048B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Feb 15, 2022·2 cites·19 claims
- 0285US2025364258A1Pulsed capacitively coupled plasma processesTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0379US11145490B2Plasma processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Oct 12, 2021·2 cites·11 claims
- 0479US9412618B2Pattern forming methodTOKYO ELECTRON LTD·Filed 2014·Granted Aug 9, 2016·4 cites·2 claims
- 0578US12400865B2Pulsed capacitively coupled plasma processesTOKYO ELECTRON LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 0676US2023386794A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0769US11545364B2Pulsed capacitively coupled plasma processesTOKYO ELECTRON LTD·Filed 2020·Granted Jan 3, 2023·0 cites·20 claims
- 0866US2021296090A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 0963US12488990B2Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Dec 2, 2025·0 cites·16 claims
- 1061US7488689B2Plasma etching methodTOKYO ELECTRON LTD·Filed 2005·Granted Feb 10, 2009·1 cites·9 claims
- 1160US12456626B2Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Oct 28, 2025·0 cites·20 claims
- 1255US12347645B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Jul 1, 2025·0 cites·18 claims
- 1355US11081351B2Method of processing substrate, device manufacturing method, and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Aug 3, 2021·0 cites·17 claims
- 1454US10991551B2Cleaning method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Apr 27, 2021·0 cites·17 claims
- 1553US10546723B2Plasma processing methodTOKYO ELECTRON LTD·Filed 2018·Granted Jan 28, 2020·0 cites·7 claims
- 1652US2024212987A1Gas supply system, gas control system, plasma processing apparatus, and gas control methodTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1751US10886138B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2019·Granted Jan 5, 2021·0 cites·10 claims
- 1851US2022351981A1Etching method, plasma processing apparatus, substrate processing system, and programTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 1950US2023386798A1Substrate processing apparatus and method for aligning ring memberTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 2049US11062882B2Plasma processing apparatus and plasma processing methodTOKYO ELECTRON LTD·Filed 2020·Granted Jul 13, 2021·0 cites·6 claims
- 2149US2025210370A1Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2246US11728176B2Treatment methodTOKYO ELECTRON LTD·Filed 2019·Granted Aug 15, 2023·0 cites·11 claims
- 2346US11594398B2Apparatus and method for plasma processingTOKYO ELECTRON LTD·Filed 2020·Granted Feb 28, 2023·0 cites·12 claims
- 2445US11569094B2Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Jan 31, 2023·0 cites·19 claims
- 2545US2021335598A1Processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 2644US2025149300A1Plasma processing apparatus and plasma processing methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2743US7387743B2Etching method and apparatus, computer program and computer readable storage mediumTOKYO ELECTRON LTD·Filed 2006·Granted Jun 17, 2008·0 cites·13 claims
- 2841US10957515B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2018·Granted Mar 23, 2021·0 cites·8 claims
- 2941US2025157799A1Monitoring method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 3039US10950458B2Etching methodTOKYO ELECTRON LTD·Filed 2019·Granted Mar 16, 2021·0 cites·9 claims
- 3139US10770268B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2018·Granted Sep 8, 2020·0 cites·10 claims
- 3239US10707088B2Method of processing target objectTOKYO ELECTRON LTD·Filed 2017·Granted Jul 7, 2020·0 cites·18 claims
- 3339US10692726B2Method for processing workpieceTOKYO ELECTRON LTD·Filed 2017·Granted Jun 23, 2020·0 cites·17 claims
- 3431US10192750B2Plasma processing methodTOKYO ELECTRON LTD·Filed 2017·Granted Jan 29, 2019·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →