Inventor · disambiguated record
Shigeru Moteki
Also filed as: MOTEKI SHIGERU
7 granted patents·7 pending applications·29 citations·filing 1997–2015
79Inventor score
Top patents by PatentIndex Score
14 records- 0173US7608336B2Flame-retardant epoxy resin composition and cured product obtained therefromNIPPON KAYAKU KK·Filed 2005·Granted Oct 27, 2009·7 cites·22 claims
- 0270US8114940B2Rubber-modified polyamide resin, epoxy resin composition and cured product thereofISHIKAWA KAZUNORI·Filed 2006·Granted Feb 14, 2012·5 cites·8 claims
- 0359US7384683B2Substrate for flexible printed wiring board and method for manufacturing the sameUNITIKA LTD·Filed 2004·Granted Jun 10, 2008·9 cites·6 claims
- 0447US7968672B2Phenolic resin, process for production thereof, epoxy resin, and use thereofNIPPON KAYAKU KK·Filed 2006·Granted Jun 28, 2011·0 cites·13 claims
- 0547US7863345B2Process for producing microparticulate hardening catalystNIPPON KAYAKU KK·Filed 2006·Granted Jan 4, 2011·0 cites·3 claims
- 0645US5780571ANaphthalene ring-containing resins, resin compositions and cured products thereofNIPPON KAYAKU KK·Filed 1997·Granted Jul 14, 1998·8 cites·14 claims
- 0744US2009056982A1Process for producing a double-sided flexible printed board and double-sided flexible printed boardAKATSUKA YASUMASA·Filed 2006·Application pending·0 cites
- 0842US2006058469A1Flame retardant epoxy resin composition and cured object obtained therefromAKATSUKA YASUMASA·Filed 2003·Application pending·0 cites
- 0942US2008153976A1Epoxy Resin, Epoxy Resin Composition, And Cured Material ThereofNIPPON KAYAKU KK·Filed 2005·Application pending·0 cites
- 1040US2012288725A1Heat-Resistant AdhesiveTANAKA RYUTARO·Filed 2011·Application pending·0 cites
- 1140US2010233476A1Copper foil with primer resin layer and laminated sheet using the sameUCHIDA MAKOTO·Filed 2007·Application pending·0 cites
- 1237US8410620B2Primer resin for semiconductor device and semiconductor deviceUCHIDA MAKOTO·Filed 2008·Granted Apr 2, 2013·0 cites·8 claims
- 1333US2017231088A1Double-sided circuit substrate suitable for high-frequency circuitsNIPPON KAYAKU KK·Filed 2015·Application pending·0 cites
- 1430US2012178332A1Fiber Comprising Heat Curable Polyamide Resin Composition, Nonwoven Fabric And Producing Method ThereofUCHIDA MAKOTO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →