Inventor · disambiguated record
Shinichi Namioka
Also filed as: NAMIOKA SHINICHI
14 granted patents·2 pending applications·136 citations·filing 1999–2020
92Inventor score
Files withDISCO CORP14
Top patents by PatentIndex Score
16 records- 0178US10916459B2Protective member forming apparatusDISCO CORP·Filed 2019·Granted Feb 9, 2021·2 cites·4 claims
- 0276US6382609B1Chuck tableDISCO CORP·Filed 2000·Granted May 7, 2002·20 cites·6 claims
- 0374US9314895B2Grinding apparatusDISCO CORP·Filed 2014·Granted Apr 19, 2016·3 cites·10 claims
- 0474US6386191B1CSP plate holderDISCO CORP·Filed 2000·Granted May 14, 2002·25 cites·10 claims
- 0572US6927416B2Wafer support plateDISCO CORP·Filed 2003·Granted Aug 9, 2005·14 cites·16 claims
- 0665US7172950B2Method for manufacturing semiconductor chipDISCO CORP·Filed 2004·Granted Feb 6, 2007·12 cites·16 claims
- 0763US6494197B1Dicing machine for cutting CSP plate into pelletsDISCO CORP·Filed 2000·Granted Dec 17, 2002·10 cites·7 claims
- 0860US6943045B2Semiconductor wafer protective device and semiconductor wafer treatment methodDISCO CORP·Filed 2003·Granted Sep 13, 2005·8 cites·11 claims
- 0959US6341740B2Cutting-and-transferring system and pellet transferring apparatusDISCO CORP·Filed 2000·Granted Jan 29, 2002·9 cites·6 claims
- 1052US11040889B2Waste fluid treatment apparatusDISCO CORP·Filed 2020·Granted Jun 22, 2021·0 cites·3 claims
- 1148US6286499B1Method of cutting and separating a bent board into individual small divisionsDISCO CORP·Filed 1999·Granted Sep 11, 2001·15 cites·6 claims
- 1246US7222772B2Flip chip bonderDISCO CORP·Filed 2004·Granted May 29, 2007·2 cites·2 claims
- 1346US6250990B1CSP plate cutting apparatusDISCO CORP·Filed 1999·Granted Jun 26, 2001·16 cites·4 claims
- 1439US11298928B2Protective sheet disposing methodDISCO CORP·Filed 2019·Granted Apr 12, 2022·0 cites·10 claims
- 1537US2004208718A1Machine for processing electrodes formed on a plate-like workpieceFiled 2004·Application pending·0 cites
- 1634US2004092108A1Method of processing a semiconductor waferFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →