Inventor · disambiguated record
Shu-Liang Ning
Also filed as: NING SHU · NING SHU-LIANG
30 granted patents·4 pending applications·4 citations·filing 2014–2022
91Inventor score
Files withCHANGXIN MEMORY TECH INC29CHANGXIN MEMORY TECHNOLGIES INC1CORSAIR MEMORY INC1HUNAN SEMICOREPI SEMICONDUCTOR TECH CO LTD1NING SHU-LIANG1
Top patents by PatentIndex Score
34 records- 0187US11983416B2Base die, memory system, and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted May 14, 2024·1 cites·14 claims
- 0287US11978525B2Base die, memory system, and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted May 7, 2024·1 cites·20 claims
- 0384US11862229B2Reading and writing method of memory device and memory deviceCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jan 2, 2024·1 cites·11 claims
- 0476US11205499B2Memory circuit device and a method for testing the sameCHANGXIN MEMORY TECH INC·Filed 2020·Granted Dec 21, 2021·1 cites·8 claims
- 0564US11893282B2Memory systemCHANGXIN MEMORY TECH INC·Filed 2022·Granted Feb 6, 2024·0 cites·15 claims
- 0659US12354941B2Chip package structure and storage systemCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jul 8, 2025·0 cites·15 claims
- 0759US11928357B2Method and system for adjusting memory, and semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2022·Granted Mar 12, 2024·0 cites·13 claims
- 0859US11735233B2Method and system for regulating memory, and semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2021·Granted Aug 22, 2023·0 cites·18 claims
- 0958US11915784B2Memory chip and memory systemCHANGXIN MEMORY TECH INC·Filed 2022·Granted Feb 27, 2024·0 cites·18 claims
- 1058US11862290B2Memory chip and memory systemCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jan 2, 2024·0 cites·19 claims
- 1157US11886721B2Method and system for adjusting memory, and semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jan 30, 2024·0 cites·19 claims
- 1256US12092685B2Chip and chip test systemCHANGXIN MEMORY TECH INC·Filed 2021·Granted Sep 17, 2024·0 cites·18 claims
- 1356US11847344B2Base die, memory system, and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Dec 19, 2023·0 cites·18 claims
- 1455US12164374B2Base die with error checking and correction , memory system, and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Dec 10, 2024·0 cites·18 claims
- 1554US11853591B2Base die, memory system, and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Dec 26, 2023·0 cites·16 claims
- 1654US11545468B2Wafer stacking method and wafer stacking structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jan 3, 2023·0 cites·20 claims
- 1754US2024189304A1Bet protein inhibitors and use thereofUNIV CALIFORNIA·Filed 2022·Application pending·0 cites
- 1853US11914417B2MemoryCHANGXIN MEMORY TECH INC·Filed 2022·Granted Feb 27, 2024·0 cites·16 claims
- 1952US11645151B1Base die, memory system, and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted May 9, 2023·0 cites·19 claims
- 2052US11488653B2Power supply system and semiconductor package assemblyCHANGXIN MEMORY TECH INC·Filed 2021·Granted Nov 1, 2022·0 cites·20 claims
- 2152US11348873B2Wafer stacking method and wafer stacking structureCHANGXIN MEMORY TECH INC·Filed 2020·Granted May 31, 2022·0 cites·16 claims
- 2251US11886357B2Memory for reducing cost and power consumptionCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jan 30, 2024·0 cites·19 claims
- 2351US11320484B2Test method and test systemCHANGXIN MEMORY TECH INC·Filed 2021·Granted May 3, 2022·0 cites·19 claims
- 2450US11984190B2Method and system for adjusting memory, and semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2021·Granted May 14, 2024·0 cites·20 claims
- 2550US11482272B2Power supply system and semiconductor package assemblyCHANGXIN MEMORY TECH INC·Filed 2021·Granted Oct 25, 2022·0 cites·20 claims
- 2650US2023287594A1Effusion cell with retractable crucible for molecular beam epitaxyHUNAN SEMICOREPI SEMICONDUCTOR TECH CO LTD·Filed 2020·Application pending·0 cites
- 2749US11536770B2Chip test method, apparatus, device, and systemCHANGXIN MEMORY TECH INC·Filed 2021·Granted Dec 27, 2022·0 cites·13 claims
- 2848US11854640B2Memory device, testing method and using method thereof, and memory systemCHANGXIN MEMORY TECH INC·Filed 2021·Granted Dec 26, 2023·0 cites·19 claims
- 2947US11854662B2MemoryCHANGXIN MEMORY TECH INC·Filed 2021·Granted Dec 26, 2023·0 cites·19 claims
- 3042US2022129397A1Storage systemCHANGXIN MEMORY TECHNOLGIES INC·Filed 2022·Application pending·0 cites
- 3139US2021134384A1SYSTEM-IN-PACKAGE (SiP) ASSEMBLYCHANGXIN MEMORY TECH INC·Filed 2021·Application pending·0 cites
- 3238US11710530B2Memory device and test circuit for the sameCHANGXIN MEMORY TECH INC·Filed 2020·Granted Jul 25, 2023·0 cites·13 claims
- 3333US9203409B2Wafer-level stacked chip assembly and chip layer utilized for the assemblyNING SHU-LIANG·Filed 2014·Granted Dec 1, 2015·0 cites·15 claims
- 3427US10153041B2Dual inline memory module with temperature-sensing scenario modeCORSAIR MEMORY INC·Filed 2016·Granted Dec 11, 2018·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →