Inventor · disambiguated record
Shinichi Nitta
Also filed as: NITTA SHINICHI
28 granted patents·8 pending applications·397 citations·filing 1995–2024
96Inventor score
Files withTOSHIBA KK14CKD CORP10AOTO JUN2KUBO HIDETAKA2EBARA REFRIGERATION EQUIPMENT & SYSTEMS CO LTD1
Top patents by PatentIndex Score
36 records- 0195US6835981B2Semiconductor chip which combines bulk and SOI regions and separates same with plural isolation regionsTOSHIBA KK·Filed 2001·Granted Dec 28, 2004·88 cites·16 claims
- 0290US6630714B2Semiconductor device formed in semiconductor layer arranged on substrate with one of insulating film and cavity interposed between the substrate and the semiconductor layerTOSHIBA KK·Filed 2002·Granted Oct 7, 2003·47 cites·36 claims
- 0390US6041814AVacuum pressure control systemCKD CORP·Filed 1995·Granted Mar 28, 2000·54 cites·15 claims
- 0488US6906384B2Semiconductor device having one of patterned SOI and SON structureTOSHIBA KK·Filed 2002·Granted Jun 14, 2005·44 cites·19 claims
- 0585US7057259B2Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from themTOSHIBA KK·Filed 2002·Granted Jun 6, 2006·35 cites·38 claims
- 0684US8521073B2Intermediate transfer member and image forming apparatus using the sameKUBO HIDETAKA·Filed 2011·Granted Aug 27, 2013·4 cites·8 claims
- 0783US9063475B2Intermediate transfer belt and electrophotographic apparatusAOTO JUN·Filed 2011·Granted Jun 23, 2015·4 cites·11 claims
- 0882US7420249B2Semiconductor device formed in semiconductor layer arranged on substrate with one of insulating film and cavity interposed between the substrate and the semiconductor layerTOSHIBA KK·Filed 2007·Granted Sep 2, 2008·7 cites·7 claims
- 0980US6855976B2Semiconductor device using partial SOI substrate and manufacturing method thereofTOSHIBA KK·Filed 2002·Granted Feb 15, 2005·24 cites·8 claims
- 1077US7700381B2Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from themKABUSHIKIA KAISHA TOSHIBA·Filed 2006·Granted Apr 20, 2010·9 cites·1 claims
- 1176US7018904B2Semiconductor chip having multiple functional blocks integrated in a single chip and method for fabricating the sameTOSHIBA KK·Filed 2004·Granted Mar 28, 2006·17 cites·13 claims
- 1274US7510945B2Element formation substrate, method of manufacturing the same, and semiconductor deviceTOSHIBA KK·Filed 2007·Granted Mar 31, 2009·5 cites·10 claims
- 1374US7148543B2Semiconductor chip which combines bulk and SOI regions and separates same with plural isolation regionsTOSHIBA KK·Filed 2004·Granted Dec 12, 2006·16 cites·17 claims
- 1472US8807014B2Multi-layer diaphragmCKD CORP·Filed 2013·Granted Aug 19, 2014·3 cites·12 claims
- 1572US7439112B2Semiconductor device using partial SOI substrate and manufacturing method thereofTOSHIBA KK·Filed 2006·Granted Oct 21, 2008·4 cites·5 claims
- 1670US6202681B1Vacuum pressure control systemCKD CORP·Filed 2000·Granted Mar 20, 2001·12 cites·4 claims
- 1766US8888471B2Liquid feed pump and flow control deviceCKD CORP·Filed 2013·Granted Nov 18, 2014·1 cites·8 claims
- 1865US8760717B2Intermediate transfer belt and image forming apparatusKUBO HIDETAKA·Filed 2012·Granted Jun 24, 2014·2 cites·10 claims
- 1964US7019365B2Semiconductor device formed in semiconductor layer arranged on substrate with one of insulating film and cavity interposed between the substrate and the semiconductor layerTOSHIBA KK·Filed 2003·Granted Mar 28, 2006·8 cites·3 claims
- 2064US2024353247A1Flow rate measurement unit, flow rate measurement system, and flow rate measurement methodCKD CORP·Filed 2024·Application pending·0 cites
- 2160US12280346B2MicromixerCKD CORP·Filed 2022·Granted Apr 22, 2025·0 cites·18 claims
- 2260US9223256B2Intermediate transfer belt method for producing intermediate transfer belt, and image forming apparatusKATOH SAYAKA·Filed 2013·Granted Dec 29, 2015·1 cites·2 claims
- 2357US12510273B2Temperature control systemCKD CORP·Filed 2024·Granted Dec 30, 2025·0 cites·16 claims
- 2456US7285825B2Element formation substrate for forming semiconductor deviceTOSHIBA KK·Filed 2003·Granted Oct 23, 2007·6 cites·7 claims
- 2555US7060133B2Single crystal pulling apparatus for a metal fluorideTOKUYAMA CORP·Filed 2003·Granted Jun 13, 2006·4 cites·8 claims
- 2654US12092242B2Pipe welding structureCKD CORP·Filed 2022·Granted Sep 17, 2024·0 cites·15 claims
- 2752US2023317482A1Temperature regulating apparatus for semiconductor-device manufacturing equipment, and semiconductor-device manufacturing systemEBARA REFRIGERATION EQUIPMENT & SYSTEMS CO LTD·Filed 2023·Application pending·0 cites
- 2849US7112822B2Semiconductor device using partial SOI substrate and manufacturing method thereofTOSHIBA KK·Filed 2004·Granted Sep 26, 2006·2 cites·9 claims
- 2948US2005156245A1Semiconductor device formed in semiconductor layer arranged on substrate with one of insulating film and cavity interposed between the substrate and the semiconductor layerFiled 2005·Application pending·0 cites
- 3048US2015021505A1Lever type switching valveCKD CORP·Filed 2014·Application pending·0 cites
- 3143US12196500B2Heat exchange systemCKD CORP·Filed 2020·Granted Jan 14, 2025·0 cites·15 claims
- 3241US9791808B2Intermediate transfer belt, method for producing the same, and image forming apparatusAOTO JUN·Filed 2011·Granted Oct 17, 2017·0 cites·10 claims
- 3340US2003201512A1Semiconductor device having one of patterned SOI and SON structureFiled 2003·Application pending·0 cites
- 3437US2011019077A1Camera module fabricating method and camera moduleTOSHIBA KK·Filed 2010·Application pending·0 cites
- 3537US2012201578A1Intermediate transfer belt, image forming apparatus, and method for producing intermediate transfer beltMASHIKO KENICHI·Filed 2012·Application pending·0 cites
- 3631US2012230740A1Intermediate transfer belt and image forming apparatus using the sameMIKAMI YOSHIHARU·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →