Inventor · disambiguated record
Shingo Ohsaka
Also filed as: OHSAKA SHINGO
8 granted patents·1 pending application·141 citations·filing 1998–2003
89Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0192US6232650B1Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuitingHITACHI LTD·Filed 1998·Granted May 15, 2001·94 cites·9 claims
- 0275US6764878B2Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrateRENESAS TECH CORP·Filed 2002·Granted Jul 20, 2004·13 cites·8 claims
- 0370US6590275B2Ball grid array type semiconductor package having a flexible substrateHITACHI LTD·Filed 2002·Granted Jul 8, 2003·10 cites·15 claims
- 0468US6437428B1Ball grid array type semiconductor package having a flexible substrateHITACHI HOKKAI SEMICONDUCTOR·Filed 2000·Granted Aug 20, 2002·9 cites·2 claims
- 0560US6887739B2Method of manufacturing semiconductor package including forming a resin sealing memberHITACHI HOKKAI SEMICONDUCTOR·Filed 2003·Granted May 3, 2005·5 cites·9 claims
- 0657US6476466B2Ball grid array type semiconductor package having a flexible substrateHITACHI HOKKAI SEMICONDUCTOR·Filed 2002·Granted Nov 5, 2002·4 cites·1 claims
- 0757US6448111B1Method of manufacturing a semiconductor deviceHITACHI HOKKAI SEMICONDUCTOR·Filed 2000·Granted Sep 10, 2002·4 cites·7 claims
- 0850US6759279B2Method of manufacturing semiconductor device having resin sealing bodyRENESAS TECH CORP·Filed 2002·Granted Jul 6, 2004·2 cites·6 claims
- 0935US2001015489A1Semiconductor device and its manufacturing methodFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →