Inventor · disambiguated record
Shinji Ohuchi
Also filed as: OHUCHI SHINJI
49 granted patents·4 pending applications·1,553 citations·filing 1995–2011
99Inventor score
Top patents by PatentIndex Score
53 records- 0197US6107164AUsing grooves as alignment marks when dicing an encapsulated semiconductor waferOKI ELECTRIC IND CO LTD·Filed 1998·Granted Aug 22, 2000·259 cites·17 claims
- 0296US6573598B2Semiconductor device and method of fabricating the sameOKI ELECTRIC IND CO LTD·Filed 2000·Granted Jun 3, 2003·132 cites·22 claims
- 0396US6259163B1Bond pad for stress releif between a substrate and an external substrateOKI ELECTRIC IND CO LTD·Filed 1998·Granted Jul 10, 2001·107 cites·9 claims
- 0495US6673651B2Method of manufacturing semiconductor device including semiconductor elements mounted on base plateOKI ELECTRIC IND CO LTD·Filed 2001·Granted Jan 6, 2004·63 cites·24 claims
- 0595US6208021B1Semiconductor device, manufacturing method thereof and aggregate type semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1997·Granted Mar 27, 2001·187 cites·20 claims
- 0695US6201266B1Semiconductor device and method for manufacturing the sameOKI ELECTRIC IND CO LTD·Filed 1999·Granted Mar 13, 2001·116 cites·20 claims
- 0794US7405138B2Manufacturing method of stack-type semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2005·Granted Jul 29, 2008·28 cites·9 claims
- 0894US6353267B1Semiconductor device having first and second sealing resinsOKI ELECTRIC IND CO LTD·Filed 2000·Granted Mar 5, 2002·69 cites·9 claims
- 0990US6562658B2Method of making semiconductor device having first and second sealing resinsOKI ELECTRIC IND CO LTD·Filed 2001·Granted May 13, 2003·45 cites·3 claims
- 1087US6852564B2Semiconductor device and method of fabricating the sameOKI ELECTRIC IND CO LTD·Filed 2002·Granted Feb 8, 2005·40 cites·18 claims
- 1185US5999413AResin sealing type semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1997·Granted Dec 7, 1999·57 cites·24 claims
- 1283US6403398B2Semiconductor device, manufacturing method thereof and aggregate type semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2000·Granted Jun 11, 2002·30 cites·7 claims
- 1381US6476501B1Semiconductor device, manufacturing method for semiconductor device and mounting method for the sameOKI ELECTRIC IND CO LTD·Filed 1999·Granted Nov 5, 2002·33 cites·28 claims
- 1480US6084293AStacked semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1998·Granted Jul 4, 2000·63 cites·13 claims
- 1579US7019397B2Semiconductor device, manufacturing method of semiconductor device, stack type semiconductor device, and manufacturing method of stack type semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2001·Granted Mar 28, 2006·23 cites·11 claims
- 1678US7977229B2Method for fabricating resin-molded semiconductor device having posts with bumpsOKI SEMICONDUCTOR CO LTD·Filed 2007·Granted Jul 12, 2011·6 cites·12 claims
- 1778US6590257B2Semiconductor device and method for manufacturing the same, semiconductor wafer and semiconductor device manufactured therebyOKI ELECTRIC IND CO LTD·Filed 2001·Granted Jul 8, 2003·22 cites·16 claims
- 1877US6271588B1Semiconductor device and manufacturing method thereofOKI ELECTRIC IND CO LTD·Filed 2000·Granted Aug 7, 2001·18 cites·16 claims
- 1975US8008129B2Method of making semiconductor device packaged by sealing resin memberOKI SEMICONDUCTOR CO LTD·Filed 2010·Granted Aug 30, 2011·2 cites·15 claims
- 2074US7928546B2Semiconductor device and manufacturing method thereofOKI ELECTRIC IND CO LTD·Filed 2007·Granted Apr 19, 2011·6 cites·5 claims
- 2174US6613694B2Semiconductor device, manufacturing method for semiconductor device and mounting method for the sameOKI ELECTRIC IND CO LTD·Filed 2002·Granted Sep 2, 2003·13 cites·30 claims
- 2272US6495916B1Resin-encapsulated semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1999·Granted Dec 17, 2002·38 cites·16 claims
- 2371US6699735B2Semiconductor device and method for manufacturing the semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2003·Granted Mar 2, 2004·13 cites·8 claims
- 2470US6251704B1Method of manufacturing semiconductor devices having solder bumps with reduced cracksOKI ELECTRIC IND CO LTD·Filed 1999·Granted Jun 26, 2001·25 cites·20 claims
- 2569US7307337B2Resin-molded semiconductor device having posts with bumps and method for fabricating the sameOKI ELECTRIC IND CO LTD·Filed 2005·Granted Dec 11, 2007·3 cites·9 claims
- 2666US6911722B2Resin-molded semiconductor device having posts with bumpsOKI ELECTRIC IND CO LTD·Filed 2001·Granted Jun 28, 2005·10 cites·10 claims
- 2765US5998877ASemiconductor device packaged in plastic and mold employable for production thereofOKI ELECTRIC IND CO LTD·Filed 1997·Granted Dec 7, 1999·31 cites·20 claims
- 2858US6130480AStructure for packaging semiconductor chipOKI ELECTRIC IND CO LTD·Filed 1998·Granted Oct 10, 2000·22 cites·12 claims
- 2957US6750125B2Semiconductor device and method for manufacturing the same, semiconductor wafer and semiconductor device manufactured therebyOKI ELECTRIC IND CO LTD·Filed 2003·Granted Jun 15, 2004·6 cites·18 claims
- 3054US6653218B2Method of fabricating resin-encapsulated semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2002·Granted Nov 25, 2003·5 cites·10 claims
- 3153US7704801B2Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor deviceOKI SEMICONDUCTOR CO LTD·Filed 2008·Granted Apr 27, 2010·0 cites·6 claims
- 3252US5877542APlastic molded type semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1997·Granted Mar 2, 1999·17 cites·18 claims
- 3351US7723832B2Semiconductor device including semiconductor elements mounted on base plateOKI SEMICONDUCTOR CO LTD·Filed 2003·Granted May 25, 2010·2 cites·12 claims
- 3450US7592690B2Semiconductor device including semiconductor elements mounted on base plateOKI SEMICONDUCTOR CO LTD·Filed 2005·Granted Sep 22, 2009·0 cites·8 claims
- 3550US7427810B2Semiconductor device including semiconductor element mounted on another semiconductor elementOKI ELECTRIC IND CO LTD·Filed 2005·Granted Sep 23, 2008·0 cites·21 claims
- 3648US8486728B2Semiconductor device including semiconductor elements mounted on base plateOHUCHI SHINJI·Filed 2011·Granted Jul 16, 2013·0 cites·3 claims
- 3748US2010025710A1Semiconductor device and fabrication method thereofOKI SEMICONDUCTOR CO LTD·Filed 2009·Application pending·0 cites
- 3848US2010055834A1Semiconductor device manufacturing methodOKI SEMICONDUCTOR CO LTD·Filed 2009·Application pending·0 cites
- 3945US6274938B1Resin-sealed semiconductor device and method of manufacturing the deviceOKI ELECTRIC IND CO LTD·Filed 1998·Granted Aug 14, 2001·10 cites·13 claims
- 4045US6258621B1Method of fabricating a semiconductor device having insulating tape interposed between chip and chip supportOKI ELECTRIC IND CO LTD·Filed 1999·Granted Jul 10, 2001·10 cites·28 claims
- 4145US6229222B1Semiconductor device and method of fabricating the sameOKI ELECTRIC IND CO LTD·Filed 1998·Granted May 8, 2001·12 cites·19 claims
- 4242US6204563B1Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1998·Granted Mar 20, 2001·10 cites·27 claims
- 4342US6002181AStructure of resin molded type semiconductor device with embedded thermal dissipatorOKI ELECTRIC IND CO LTD·Filed 1995·Granted Dec 14, 1999·11 cites·12 claims
- 4442US2004173895A1Semiconductor device and manufacturing method thereofFiled 2004·Application pending·0 cites
- 4540US7314779B2Semiconductor device, manufacturing method for semiconductor device and mounting method for the sameOKI ELECTRIC IND CO LTD·Filed 2003·Granted Jan 1, 2008·0 cites·10 claims
- 4640US6734092B2Semiconductor device and manufacturing method thereofOKI ELECTRIC IND CO LTD·Filed 2001·Granted May 11, 2004·0 cites·26 claims
- 4740US6680535B2Semiconductor device, manufacturing method for semiconductor device and mounting method for the sameOKI ELECTRIC IND CO LTD·Filed 2003·Granted Jan 20, 2004·0 cites·28 claims
- 4839US6541306B2Resin-sealed semiconductor device and method of manufacturing the deviceOKI ELECTRIC IND CO LTD·Filed 2001·Granted Apr 1, 2003·0 cites·7 claims
- 4938US2001005060A1Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor deviceFiled 2000·Application pending·0 cites
- 5037US6181003B1Semiconductor device packaged in plastic packageOKI ELECTRIC IND CO LTD·Filed 1997·Granted Jan 30, 2001·6 cites·3 claims
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →