Inventor · disambiguated record
Shinji Otani
Also filed as: OTANI SHINJI
54 granted patents·9 pending applications·93 citations·filing 1994–2025
97Inventor score
Files withMURATA MANUFACTURING CO38HODOGAYA CHEMICAL CO LTD6MITSUBISHI MATERIALS CORP5KYOCERA DOCUMENT SOLUTIONS INC4YAMAJI TAKASHI4
Top patents by PatentIndex Score
63 records- 0197US9984805B2Inductor componentMURATA MANUFACTURING CO·Filed 2016·Granted May 29, 2018·14 cites·11 claims
- 0294US11842842B2Inductor component and manufacturing method of inductor componentMURATA MANUFACTURING CO·Filed 2021·Granted Dec 12, 2023·2 cites·18 claims
- 0394US9881737B2Laminated ceramic electronic componentMURATA MANUFACTURING CO·Filed 2015·Granted Jan 30, 2018·7 cites·10 claims
- 0491US11227715B2Electronic componentMURATA MANUFACTURING CO·Filed 2016·Granted Jan 18, 2022·5 cites·18 claims
- 0590US9881741B2Multilayer ceramic electronic componentMURATA MANUFACTURING CO·Filed 2015·Granted Jan 30, 2018·4 cites·18 claims
- 0686US8308841B2Clayish composition for forming sintered silver alloy body, powder for clayish composition for forming sintered silver alloy body, method for manufacturing clayish composition for forming sintered silver alloy body, sintered silver alloy body, and method for manufacturing sintered silver alloy bodyYAMAJI TAKASHI·Filed 2011·Granted Nov 13, 2012·4 cites·18 claims
- 0785US9202640B2Ceramic electronic component and manufacturing method thereofZENZAI KOTA·Filed 2011·Granted Dec 1, 2015·7 cites·6 claims
- 0882US11810706B2Multilayer metal film and inductor componentMURATA MANUFACTURING CO·Filed 2020·Granted Nov 7, 2023·1 cites·20 claims
- 0982US9947473B2Multilayer ceramic capacitorMURATA MANUFACTURING CO·Filed 2016·Granted Apr 17, 2018·2 cites·20 claims
- 1082US9535356B2Image forming apparatus having a function to apply charge removal light to photosensitive memberKYOCERA DOCUMENT SOLUTIONS INC·Filed 2015·Granted Jan 3, 2017·2 cites·12 claims
- 1181US10269494B2Multilayer ceramic capacitor including external electrodes with multilayer structure and manufacturing method thereforMURATA MANUFACTURING CO·Filed 2016·Granted Apr 23, 2019·2 cites·19 claims
- 1281US9639024B2Developing device and image forming apparatus including sameKYOCERA DOCUMENT SOLUTIONS INC·Filed 2016·Granted May 2, 2017·2 cites·11 claims
- 1380US9665037B2Developing device and image forming apparatus including sameKYOCERA DOCUMENT SOLUTIONS INC·Filed 2016·Granted May 30, 2017·2 cites·10 claims
- 1480US8496726B2Clayish composition for forming sintered silver alloy body, powder for clayish composition for forming sintered silver alloy body, method for manufacturing clayish composition for forming sintered silver alloy body, sintered silver alloy body, and method for manufacturing sintered silver alloy bodyYAMAJI TAKASHI·Filed 2012·Granted Jul 30, 2013·2 cites·8 claims
- 1579US10903017B2Solid electrolytic capacitorMURATA MANUFACTURING CO·Filed 2017·Granted Jan 26, 2021·2 cites·23 claims
- 1678US10340092B2Solid electrolytic capacitorMURATA MANUFACTURING CO·Filed 2017·Granted Jul 2, 2019·2 cites·17 claims
- 1776US10483041B2Monolithic ceramic capacitor and structure for mounting the sameMURATA MANUFACTURING CO·Filed 2015·Granted Nov 19, 2019·2 cites·13 claims
- 1875US9490076B2Solid electrolytic capacitor and manufacturing method thereforMURATA MANUFACTURING CO·Filed 2014·Granted Nov 8, 2016·2 cites·4 claims
- 1975US2024363289A1Method for manufacturing multilayer ceramic electronic component, and multilayer ceramic electronic componentMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 2072US9627133B2Laminated ceramic electronic componentMURATA MANUFACTURING CO·Filed 2015·Granted Apr 18, 2017·1 cites·10 claims
- 2172US9490055B2Ceramic electronic component and manufacturing method thereofZENZAI KOTA·Filed 2011·Granted Nov 8, 2016·2 cites·6 claims
- 2271US11626250B2Method for manufacturing multilayer ceramic electronic component, and multilayer ceramic electronic componentMURATA MANUFACTURING CO·Filed 2020·Granted Apr 11, 2023·0 cites·15 claims
- 2368US10153082B2Electronic component and method of manufacturing electronic componentMURATA MANUFACTURING CO·Filed 2016·Granted Dec 11, 2018·1 cites·15 claims
- 2468US9078359B2Chip-type ceramic electronic component and producing method thereofMURATA MANUFACTURING CO·Filed 2013·Granted Jul 7, 2015·1 cites·18 claims
- 2567US2025191843A1Multilayer ceramic capacitorMURATA MANUFACTURING CO·Filed 2025·Application pending·0 cites
- 2666US11721469B2Electronic component and production method thereofMURATA MANUFACTURING CO·Filed 2020·Granted Aug 8, 2023·0 cites·20 claims
- 2765US12482732B2ModuleMURATA MANUFACTURING CO·Filed 2022·Granted Nov 25, 2025·0 cites·19 claims
- 2865US12020852B2Electronic componentMURATA MANUFACTURING CO·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
- 2965US9399254B2Clayish composition for forming sintered silver alloy body, powder for clayish composition for forming sintered silver alloy body, method for manufacturing clayish composition for forming sintered silver alloy body, sintered silver alloy body, and method for manufacturing sintered silver alloy bodyMITSUBISHI MATERIALS CORP·Filed 2013·Granted Jul 26, 2016·0 cites·6 claims
- 3065US9263188B2Conductive resin composition and chip-type electronic componentOTANI SHINJI·Filed 2010·Granted Feb 16, 2016·1 cites·20 claims
- 3164US11804325B2Electronic component and production method thereofMURATA MANUFACTURING CO·Filed 2020·Granted Oct 31, 2023·0 cites·6 claims
- 3263US8244154B2Recycling method of toner containerITO TAKAHIRO·Filed 2009·Granted Aug 14, 2012·2 cites·12 claims
- 3363US2019066909A1Electronic component and method of manufacturing electronic componentMURATA MANUFACTURING CO·Filed 2018·Application pending·0 cites
- 3462US11798723B2Multilayer metal film and inductor componentMURATA MANUFACTURING CO·Filed 2020·Granted Oct 24, 2023·0 cites·20 claims
- 3562US2024332346A1Module and semiconductor composite deviceMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 3661US11972909B2Capacitor, connection structure, and method for manufacturing capacitorMURATA MANUFACTURING CO·Filed 2022·Granted Apr 30, 2024·0 cites·20 claims
- 3761US11694839B2Base configured as an electronic component or a circuit boardMURATA MANUFACTURING CO·Filed 2020·Granted Jul 4, 2023·0 cites·20 claims
- 3860US12288636B2Electronic component and method for manufacturing the sameMURATA MANUFACTURING CO·Filed 2021·Granted Apr 29, 2025·0 cites·18 claims
- 3960US9472351B2Solid electrolytic capacitor, electronic component module, method for producing solid electrolytic capacitor and method for producing electronic component moduleMURATA MANUFACTURING CO·Filed 2015·Granted Oct 18, 2016·1 cites·16 claims
- 4060US2024387106A1Multilayer ceramic capacitorMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 4159US11676757B2Electronic component and method of manufacturing electronic componentMURATA MANUFACTURING CO·Filed 2020·Granted Jun 13, 2023·0 cites·20 claims
- 4259US9598561B2Silver powder for silver clay and silver clay including same silver powderMITSUBISHI MATERIALS CORP·Filed 2012·Granted Mar 21, 2017·0 cites·5 claims
- 4359US7094512B2Electrophotographic printing method, monoazo iron complex compound, charge controlling agent using the same and toner using the charge controlling agentHODOGAYA CHEMICAL CO LTD·Filed 2003·Granted Aug 22, 2006·7 cites·29 claims
- 4458US11948726B2Inductor componentMURATA MANUFACTURING CO·Filed 2020·Granted Apr 2, 2024·0 cites·20 claims
- 4558US9194025B2Method of manufacturing sintered silver alloy body and copper oxide-containing clay-like compositionYAMAJI TAKASHI·Filed 2011·Granted Nov 24, 2015·0 cites·5 claims
- 4657US10239121B2Clay-like composition for sintered precious metal bodyMITSUBISHI MATERIALS CORP·Filed 2014·Granted Mar 26, 2019·0 cites·5 claims
- 4756US11017950B2Method for producing a ceramic electronic componentMURATA MANUFACTURING CO·Filed 2016·Granted May 25, 2021·0 cites·5 claims
- 4854US9779876B2Ceramic electronic component and method for producing the sameMURATA MANUFACTURING CO·Filed 2015·Granted Oct 3, 2017·0 cites·7 claims
- 4953US2016297004A1Clay-like shaped body for forming sintered precious metal bodyMITSUBISHI MATERIALS CORP·Filed 2014·Application pending·0 cites
- 5052US11776754B2Electronic component and mounting structureMURATA MANUFACTURING CO·Filed 2021·Granted Oct 3, 2023·0 cites·19 claims
Showing the top 50 of 63 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Shinji Otani files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →