US2019066909A1PendingUtilityA1
Electronic component and method of manufacturing electronic component
Est. expiryDec 4, 2035(~9.4 yrs left)· nominal 20-yr term from priority
H01F 41/046H01C 7/008H01F 2017/0066H01F 41/0246H01F 2017/048H05K 1/165H01G 4/236H01F 27/255H01G 4/33H01G 4/232H01F 1/0306H01C 1/14H01G 4/40H01G 4/252H01C 17/28H01F 17/0033H01F 17/0013H01F 17/04H01G 4/2325H01F 41/0206H01G 4/008H01F 27/2804H01C 7/18H01F 27/292H01F 27/29H01L 41/0477C23C 18/2013C23C 18/1641C23C 18/31C23C 18/38H10N 30/877
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Claims
Abstract
An electronic component includes a composite body made of a composite material of a resin material and a metal powder; and a metal film disposed on an outer surface of the composite body. The metal film is in contact with the resin material and the metal powder of the composite body, and an average particle diameter of crystals of the metal film contacting the resin material is 60% or more and 120% or less of an average particle diameter of crystals of the metal film contacting the metal powder.
Claims
exact text as granted — not AI-modified1 . A method of manufacturing an electronic component comprising:
a grinding step of grinding a portion of a composite body made of a composite material of a resin material and a metal powder to expose the metal powder from a ground surface of the composite body; and a metal film formation step of forming a metal film on the ground surface of the composite body by using electroless plating.
2 . The method of manufacturing an electronic component according to claim 1 , wherein
at the metal film formation step, the metal film is formed on the resin material and the metal powder by using the electroless plating.
3 . The method of manufacturing an electronic component according to claim 1 , wherein
at the metal film formation step, the metal film is formed by using a displacement precipitation reaction to precipitate the metal film on the metal powder exposed from the ground surface and by growing the precipitated metal film by using the electroless plating.
4 . The method of manufacturing an electronic component according to claim 1 , wherein at the metal film formation step, the electroless plating is performed without applying a catalyst.
5 . The method of manufacturing an electronic component according to claim 1 , wherein
the metal powder is made of metal or alloy containing Fe, and wherein the metal film is made of metal or alloy containing Cu.
6 . The method of manufacturing an electronic component according to claim 1 , further comprising a resin film formation step of forming a resin film on a region of a portion of the ground surface of the composite body after the grinding step, wherein
the resin film is used as a mask to form the metal film at metal film formation step.Cited by (0)
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