Inventor · disambiguated record
Shirish A. Pethe
Also filed as: PETHE SHIRISH · PETHE SHIRISH A
12 granted patents·6 pending applications·2 citations·filing 2012–2023
80Inventor score
Top patents by PatentIndex Score
18 records- 0178US11075165B2Methods and apparatus for forming dual metal interconnectsAPPLIED MATERIALS INC·Filed 2019·Granted Jul 27, 2021·2 cites·18 claims
- 0268US2023122969A1Method of depositing layersAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 0364US11948885B2Methods and apparatus for forming dual metal interconnectsAPPLIED MATERIALS INC·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 0463US11492699B2Substrate temperature non-uniformity reduction over target life using spacing compensationAPPLIED MATERIALS INC·Filed 2021·Granted Nov 8, 2022·0 cites·18 claims
- 0562US11562925B2Method of depositing multilayer stack including copper over features of a device structureAPPLIED MATERIALS INC·Filed 2020·Granted Jan 24, 2023·0 cites·12 claims
- 0658US12272659B2Methods for forming metal gapfill with low resistivityAPPLIED MATERIALS INC·Filed 2022·Granted Apr 8, 2025·0 cites·20 claims
- 0755US12203163B2Methods for shaping magnetic fields during semiconductor processingAPPLIED MATERIALS INC·Filed 2021·Granted Jan 21, 2025·0 cites·18 claims
- 0854US11222816B2Methods and apparatus for semi-dynamic bottom up reflowAPPLIED MATERIALS INC·Filed 2020·Granted Jan 11, 2022·0 cites·19 claims
- 0954US2024087955A1Integrated pvd tungsten liner and seamless cvd tungsten fillAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1053US2023420295A1Treatment of tungsten surface for tungsten gap-fillAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1152US12406884B2Self field-suppression CVD tungsten (W) fill on PVD W linerAPPLIED MATERIALS INC·Filed 2022·Granted Sep 2, 2025·0 cites·12 claims
- 1252US2024145300A1Buffer Layer for Dielectric Protection in Physical Vapor Deposition Metal Liner ApplicationsAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1351US11289329B2Methods and apparatus for filling a feature disposed in a substrateAPPLIED MATERIALS INC·Filed 2020·Granted Mar 29, 2022·0 cites·20 claims
- 1450US11315771B2Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2020·Granted Apr 26, 2022·0 cites·5 claims
- 1549US11417568B2Methods for selective deposition of tungsten atop a dielectric layer for bottom up gapfillAPPLIED MATERIALS INC·Filed 2020·Granted Aug 16, 2022·0 cites·20 claims
- 1649US2023023235A1Enhanced stress tuning and interfacial adhesion for tungsten (w) gap fillAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 1748US10892186B2Integration of ALD copper with high temperature PVD copper deposition for BEOL interconnectAPPLIED MATERIALS INC·Filed 2018·Granted Jan 12, 2021·0 cites·13 claims
- 1844US2012266958A1Methods of forming ruthenium-group iiia alloysAKSU SERDAR·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →