Inventor · disambiguated record
Shunan Qiu
Also filed as: QIU SHUNAN
3 granted patents·3 pending applications·6 citations·filing 2012–2012
56Inventor score
Top patents by PatentIndex Score
6 records- 0171US8692387B2Stacked die semiconductor packageQIU SHUNAN·Filed 2012·Granted Apr 8, 2014·5 cites·10 claims
- 0255US8643156B2Lead frame for assembling semiconductor deviceQIU SHUNAN·Filed 2012·Granted Feb 4, 2014·1 cites·18 claims
- 0339US8643153B2Semiconductor device with staggered leadsQIU SHUNAN·Filed 2012·Granted Feb 4, 2014·0 cites·10 claims
- 0435US2013264714A1Semiconductor device and method of assembling sameGONG GUO LIANG·Filed 2012·Application pending·0 cites
- 0535US2013037966A1Semiconductor device die bondingFREESCALE SEMICONDUCTOR INC·Filed 2012·Application pending·0 cites
- 0633US2014024199A1Semiconductor wafer dicing methodQIU SHUNAN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →