Inventor · disambiguated record
Shinya Sadohara
Also filed as: SADOHARA SHINYA
11 granted patents·1 pending application·49 citations·filing 1999–2019
86Inventor score
Files withAUTONETWORKS TECHNOLOGIES LTD5SUMCO TECHXIV CORP3SADOHARA SHINYA2KOMATSU DENSHI KINZOKU KK1TANIMOTO RYUICHI1
Top patents by PatentIndex Score
12 records- 0184US7759227B2Silicon semiconductor substrate heat-treatment method and silicon semiconductor substrate treated by the methodSUMCO TECHXIV CORP·Filed 2005·Granted Jul 20, 2010·13 cites·6 claims
- 0282US11208058B2Electrical component-attached wire harness for vehicle dashboard and assembly structure of electrical component-attached wire harnessAUTONETWORKS TECHNOLOGIES LTD·Filed 2018·Granted Dec 28, 2021·4 cites·10 claims
- 0377US10819094B2Protector-equipped electric wire and protector-equipped wire arrangement structureAUTONETWORKS TECHNOLOGIES LTD·Filed 2017·Granted Oct 27, 2020·4 cites·8 claims
- 0472US10214160B2Wire module and wire protection memberAUTONETWORKS TECHNOLOGIES LTD·Filed 2016·Granted Feb 26, 2019·2 cites·5 claims
- 0568US7141113B1Production method for silicon single crystal and production device for single crystal ingot, and heat treating method for silicon crystal waferKOMATSU DENSHI KINZOKU KK·Filed 1999·Granted Nov 28, 2006·22 cites·5 claims
- 0664US11427260B2Reinforcement and reinforcement moduleAUTONETWORKS TECHNOLOGIES LTD·Filed 2018·Granted Aug 30, 2022·1 cites·6 claims
- 0762US7875116B2Silicon single crystal producing method, annealed wafer, and method of producing annealed waferSUMCO TECHXIV CORP·Filed 2006·Granted Jan 25, 2011·2 cites·8 claims
- 0856US8573969B2Silicon wafer heat treatment methodSADOHARA SHINYA·Filed 2007·Granted Nov 5, 2013·1 cites·7 claims
- 0955US11257609B2Wire harness including electrical wires disposed between sheet material and coverAUTONETWORKS TECHNOLOGIES LTD·Filed 2019·Granted Feb 22, 2022·0 cites·11 claims
- 1051US8853103B2Method for manufacturing semiconductor waferSUMCO TECHXIV CORP·Filed 2013·Granted Oct 7, 2014·0 cites·8 claims
- 1151US8426297B2Method for manufacturing semiconductor waferSADOHARA SHINYA·Filed 2009·Granted Apr 23, 2013·0 cites·12 claims
- 1232US2013095660A1Method for polishing silicon waferTANIMOTO RYUICHI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →