Inventor · disambiguated record
Shariq Siddiqui
Also filed as: SIDDIQUI SHARIQ
27 granted patents·3 pending applications·271 citations·filing 2014–2020
95Inventor score
Top patents by PatentIndex Score
30 records- 0197US9484255B1Hybrid source and drain contact formation using metal liner and metal insulator semiconductor contactsIBM·Filed 2015·Granted Nov 1, 2016·15 cites·20 claims
- 0295US10057227B1Determination of authentication mechanismAMAZON TECH INC·Filed 2015·Granted Aug 21, 2018·159 cites·20 claims
- 0395US9613862B2Chamferless via structuresIBM·Filed 2015·Granted Apr 4, 2017·14 cites·19 claims
- 0495US9373543B1Forming interconnect features with reduced sidewall taperingGLOBALFOUNDRIES INC·Filed 2015·Granted Jun 21, 2016·19 cites·20 claims
- 0594US10554657B1Using an audio interface device to authenticate another deviceAMAZON TECH INC·Filed 2017·Granted Feb 4, 2020·25 cites·20 claims
- 0690US11062083B1Automated data entry optimization by recognizing invalid dataAMAZON TECH INC·Filed 2015·Granted Jul 13, 2021·8 cites·20 claims
- 0788US10347541B1Active gate contacts and method of fabrication thereofGLOBALFOUNDRIES INC·Filed 2018·Granted Jul 9, 2019·6 cites·20 claims
- 0888US10211094B2Hybrid source and drain contact formation using metal liner and metal insulator semiconductor contactsIBM·Filed 2017·Granted Feb 19, 2019·3 cites·15 claims
- 0988US10032668B2Chamferless via structuresIBM·Filed 2017·Granted Jul 24, 2018·4 cites·18 claims
- 1086US10818599B2Hybrid source and drain contact formation using metal liner and metal insulator semiconductor contactsIBM·Filed 2019·Granted Oct 27, 2020·2 cites·9 claims
- 1185US10134585B2Low temperature atomic layer deposition of oxides on compound semiconductorsUNIV CALIFORNIA·Filed 2015·Granted Nov 20, 2018·5 cites·16 claims
- 1285US9508560B1SiARC removal with plasma etch and fluorinated wet chemical solution combinationIBM·Filed 2015·Granted Nov 29, 2016·4 cites·20 claims
- 1384US10062560B1Method of cleaning semiconductor deviceGLOBALFOUNDRIES INC·Filed 2017·Granted Aug 28, 2018·3 cites·20 claims
- 1475US10388565B2Chamferless via structuresIBM·Filed 2018·Granted Aug 20, 2019·1 cites·18 claims
- 1573US9799559B1Methods employing sacrificial barrier layer for protection of vias during trench formationGLOBALFOUNDRIES INC·Filed 2016·Granted Oct 24, 2017·2 cites·20 claims
- 1666US9947547B2Environmentally green process and composition for cobalt wet etchIBM·Filed 2016·Granted Apr 17, 2018·1 cites·19 claims
- 1763US10937694B2Chamferless via structuresIBM·Filed 2019·Granted Mar 2, 2021·0 cites·20 claims
- 1863US10903118B2Chamferless via structuresIBM·Filed 2019·Granted Jan 26, 2021·0 cites·19 claims
- 1962US10170574B2Hybrid source and drain contact formation using metal liner and metal insulator semiconductor contactsIBM·Filed 2017·Granted Jan 1, 2019·0 cites·15 claims
- 2060US9853115B2Hybrid source and drain contact formation using metal liner and metal insulator semiconductor contactsIBM·Filed 2016·Granted Dec 26, 2017·0 cites·15 claims
- 2155US10957588B2Chamferless via structuresIBM·Filed 2016·Granted Mar 23, 2021·0 cites·20 claims
- 2254US10629428B2Metal insulator metal capacitor devicesGLOBALFOUNDRIES INC·Filed 2018·Granted Apr 21, 2020·0 cites·14 claims
- 2353US2020169552A1Using an audio interface device to authenticate another deviceAMAZON TECH INC·Filed 2020·Application pending·0 cites
- 2452US9263541B2Alternative gate dielectric films for silicon germanium and germanium channel materialsGLOBALFOUNDRIES INC·Filed 2014·Granted Feb 16, 2016·0 cites·20 claims
- 2546US2016133716A1Alternative gate dielectric films for silicon germanium and germanium channel materialsGLOBALFOUNDRIES INC·Filed 2016·Application pending·0 cites
- 2645US10139358B2Method for characterization of a layered structureIBM·Filed 2016·Granted Nov 27, 2018·0 cites·20 claims
- 2744US10658176B2Methods of mitigating cobalt diffusion in contact structures and the resulting devicesGLOBALFOUNDRIES INC·Filed 2018·Granted May 19, 2020·0 cites·18 claims
- 2842US9570344B2Method to protect MOL metallization from hardmask strip processGLOBALFOUNDRIES INC·Filed 2015·Granted Feb 14, 2017·0 cites·17 claims
- 2940US10340146B2Reliability caps for high-k dielectric annealsGLOBALFOUNDRIES INC·Filed 2017·Granted Jul 2, 2019·0 cites·16 claims
- 3032US2016343806A1Interface passivation layers and methods of fabricatingGLOBALFOUNDRIES INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →