Inventor · disambiguated record
Shogo Sobue
Also filed as: SOBUE SHOGO · SOBUE SHOGO YOUNG
7 granted patents·7 pending applications·1 citations·filing 2013–2024
70Inventor score
Top patents by PatentIndex Score
14 records- 0173US12509615B2Substrate-conveying support tape and electronic apparatus/device production methodSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Dec 30, 2025·1 cites·16 claims
- 0268US2025046626A1Semiconductor device manufacturing methodRESONAC CORP·Filed 2024·Application pending·0 cites
- 0357US2021206149A1Method for manufacturing electronic component, resin composition for temporary fixing, resin film for temporary fixing, and resin film sheet for temporary fixingSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 0453US12165882B2Semiconductor device manufacturing methodRESONAC CORP·Filed 2020·Granted Dec 10, 2024·0 cites·4 claims
- 0548US10913248B2Method for manufacturing electronic component, resin composition for temporary fixing, resin film for temporary fixing, and resin film sheet for temporary fixingHITACHI CHEMICAL CO LTD·Filed 2016·Granted Feb 9, 2021·0 cites·9 claims
- 0648US2024145256A1Method for manufacturing semiconductor deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 0747US12094749B2Resin composition for temporary fixing use, resin film for temporary fixing use, sheet for temporary fixing use, and method for manufacturing semiconductor deviceRESONAC CORP·Filed 2019·Granted Sep 17, 2024·0 cites·20 claims
- 0845US12509613B2Resin composition for provisional fixation, support tape for substrate conveyance and method for producing electronic deviceRESONAC CORP·Filed 2019·Granted Dec 30, 2025·0 cites·20 claims
- 0944US12476201B2Method for manufacturing electronic component, resin composition for temporary protection, and resin film for temporary protectionSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Nov 18, 2025·0 cites·15 claims
- 1044US2024021443A1Curable resin film, film material for semiconductor device production, curable resin composition for semiconductor device production, and method for producing semiconductor deviceRESONAC CORP·Filed 2021·Application pending·0 cites
- 1141US2024006192A1Method for manufacturing semiconductor deviceRESONAC CORP·Filed 2021·Application pending·0 cites
- 1240US2015179494A1Method for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 1335US10825694B2Method for manufacturing electronic component, resin composition for temporary protection, and resin film for temporary protectionHITACHI CHEMICAL CO LTD·Filed 2018·Granted Nov 3, 2020·0 cites·20 claims
- 1435US2022289920A1Resin composition for temporary fixation, substrate-conveying support tape, and electronic equipment device manufacturing methodSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →