Method for manufacturing electronic component, resin composition for temporary fixing, resin film for temporary fixing, and resin film sheet for temporary fixing

Abstract

A method for manufacturing an electronic component, includes: a step of temporarily fixing onto a support body a workpiece to become a member constituting an electronic component, via a film-like temporary fixing material; a step of processing the workpiece which is temporarily fixed onto the support body; and a step of separating the processed workpiece from the support body and the film-like temporary fixing material, and the film-like temporary fixing material contains an (meth)acrylic copolymer (A) having a not unevenly distributed reactive functional group.

1 . A method for manufacturing an electronic component, comprising:
 a step of temporarily fixing onto a support body a workpiece to become a member constituting an electronic component, via a film-like temporary fixing material;   a step of processing the workpiece which is temporarily fixed onto the support body; and   a step of separating the processed workpiece from the support body and the film-like temporary fixing material,   wherein the film-like temporary fixing material contains an (meth)acrylic copolymer (A) having a not unevenly distributed reactive functional group.   
     
     
         2 . The method for manufacturing an electronic component according to  claim 1 ,
 wherein the film-like temporary fixing material is provided by laminating a resin film for temporary fixing containing the (meth)acrylic copolymer (A) having a not unevenly distributed reactive functional group on the workpiece or the support body.   
     
     
         3 . The method for manufacturing an electronic component according to  claim 1 ,
 wherein the (meth)acrylic copolymer (A) having a not unevenly distributed reactive functional group contains a (meth)acrylic monomer (a-1) in which a glass transition temperature of an homopolymer is higher than or equal to 50° C., a (meth)acrylic monomer (a-2) in which a glass transition temperature of an homopolymer is lower than or equal to 0° C., and a (meth)acrylic monomer (a-3) having an reactive functional group, as a copolymer component.   
     
     
         4 . The method for manufacturing an electronic component according to  claim 3 ,
 wherein the (meth)acrylic monomer (a-2) in which the glass transition temperature of the homopolymer is lower than or equal to 0° C. is a (meth)acrylic monomer having an alkyl group of which the number of carbon atoms is 6 to 20.   
     
     
         5 . The method for manufacturing an electronic component according to  claim 1   wherein the reactive functional group is an epoxy group.   
     
     
         6 . The method for manufacturing an electronic component according to  claim 5 ,
 wherein the film-like temporary fixing material further contains an epoxy curing agent (B).   
     
     
         7 . The method for manufacturing an electronic component according to  claim 6 ,
 wherein the epoxy curing agent (B) is an imidazole-based curing agent.   
     
     
         8 . The method for manufacturing an electronic component according to  claim 1 ,
 wherein the film-like temporary fixing material further contains a silicone compound (C).   
     
     
         9 . The method for manufacturing an electronic component according to  claim 8 ,
 wherein the silicone compound (C) is a silicone modified alkyd resin.   
     
     
         10 . The method for manufacturing an electronic component according to  claim 1 ,
 wherein the film-like temporary fixing material is formed of two or more layers, and at least a layer in contact with the workpiece contains the (meth)acrylic copolymer (A) having a not unevenly distributed reactive functional group.   
     
     
         11 .- 23 . (canceled)