Assignee
SHOWA DENKO MATERIALS CO LTD
JP·122 granted patents·98 pending applications·47 citations·filing 2016–2022
Top patents by PatentIndex Score
220 records- 0193US11979990B2Wiring board and method for manufacturing the sameSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted May 7, 2024·3 cites·14 claims
- 0292US11518920B2Slurry, and polishing methodSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Dec 6, 2022·4 cites·15 claims
- 0391US11505731B2Slurry and polishing methodSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Nov 22, 2022·4 cites·16 claims
- 0491US11499078B2Slurry, polishing solution production method, and polishing methodSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Nov 15, 2022·4 cites·18 claims
- 0591US11492526B2Slurry, method for producing polishing liquid, and polishing methodSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Nov 8, 2022·4 cites·19 claims
- 0691US11015020B2Epoxy resin, epoxy resin composition, epoxy resin cured product and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2016·Granted May 25, 2021·3 cites·8 claims
- 0791US10920010B2Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2017·Granted Feb 16, 2021·3 cites·9 claims
- 0890US12004305B2Wiring board and production method for sameSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Jun 4, 2024·2 cites·13 claims
- 0989US11810834B2Thermal conduction sheet and heat dissipating device including thermal conduction sheetSHOWA DENKO MATERIALS CO LTD·Filed 2022·Granted Nov 7, 2023·2 cites·20 claims
- 1088US11466119B2Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Oct 11, 2022·2 cites·14 claims
- 1187US11440990B2Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2017·Granted Sep 13, 2022·2 cites·13 claims
- 1282US12116451B2Epoxy resin, epoxy resin composition, epoxy resin cured product and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Oct 15, 2024·1 cites·11 claims
- 1382US12103999B2Photosensitive resin composition, photosensitive resin film, printed wiring board, semiconductor package, and method for producing printed wiring boardSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Oct 1, 2024·2 cites·19 claims
- 1482US2023066239A1Polyamideimide resin composition and fluorine-containing coating materialSHOWA DENKO MATERIALS CO LTD·Filed 2022·Application pending·0 cites
- 1581US12104112B2Slurry, screening method, and polishing methodSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Oct 1, 2024·1 cites·19 claims
- 1678US12246398B2Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bumpSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Mar 11, 2025·1 cites·8 claims
- 1778US11990396B2Substrate and method for manufacturing the sameSHOWA DENKO MATERIALS CO LTD·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 1878US11737345B2Organic electronic material, ink composition containing same, and organic thin film, organic electronic element, organic electroluminescent element, lighting device, and display device formed therewithSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Aug 22, 2023·0 cites·20 claims
- 1977US12163073B2Connected electronic membersSHOWA DENKO MATERIALS CO LTD·Filed 2022·Granted Dec 10, 2024·0 cites·8 claims
- 2076US12122944B2Hot melt adhesive compositionSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Oct 22, 2024·0 cites·8 claims
- 2173US12509615B2Substrate-conveying support tape and electronic apparatus/device production methodSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Dec 30, 2025·1 cites·16 claims
- 2273US12130247B2Method of measuring physical properties, method of evaluating member, method of manufacturing electronic component device, method of manufacturing material for electronic component device, and physical property measurement systemSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Oct 29, 2024·0 cites·20 claims
- 2373US2022403081A1Composition containing compound having polyoxyalkylene chainSHOWA DENKO MATERIALS CO LTD·Filed 2020·Application pending·0 cites
- 2472US11180600B2Two-part curable urethane compositionSHOWA DENKO MATERIALS CO LTD·Filed 2016·Granted Nov 23, 2021·1 cites·8 claims
- 2571US2023163489A1Adhesive film and reel bodySHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 2671US2023002661A1Curable composition and articleSHOWA DENKO MATERIALS CO LTD·Filed 2020·Application pending·0 cites
- 2770US11814548B2Polishing liquid, polishing liquid set, and polishing methodSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Nov 14, 2023·0 cites·22 claims
- 2869US12378376B2Optically softening resin composition, method for producing softened product of optically softening resin composition, curable resin composition and cured product of same, and patterned film and method for producing sameSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Aug 5, 2025·0 cites·6 claims
- 2969US2023016868A1Curable composition set and articleSHOWA DENKO MATERIALS CO LTD·Filed 2020·Application pending·0 cites
- 3068US11623306B2Brazing filler material for bonding iron-based sintered member, and method for producing iron-based sintered partSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Apr 11, 2023·0 cites·9 claims
- 3168US2022403082A1Composition set containing compound having polyoxyalkylene chainSHOWA DENKO MATERIALS CO LTD·Filed 2020·Application pending·0 cites
- 3267US12365783B2Compound, molded article, and cured productSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Jul 22, 2025·0 cites·19 claims
- 3367US12173219B2Slurry and polishing methodSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Dec 24, 2024·0 cites·21 claims
- 3467US12114437B2Wiring structure, method for manufacturing same, and semiconductor packageSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Oct 8, 2024·0 cites·9 claims
- 3566US12049538B2Epoxy resin, epoxy resin composition, epoxy resin cured product and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Jul 30, 2024·0 cites·12 claims
- 3666US2022228029A1Water-repellent agent, water-repellent structure, and production method for said structureSHOWA DENKO MATERIALS CO LTD·Filed 2022·Application pending·0 cites
- 3765US12435236B2Coating liquid, composite material, and coating filmSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Oct 7, 2025·0 cites·2 claims
- 3865US12172240B2Solder particlesSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Dec 24, 2024·0 cites·11 claims
- 3965US11532588B2Copper paste for pressureless bonding, bonded body and semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·7 claims
- 4064US12534640B2Polishing liquid and polishing methodSHOWA DENKO MATERIALS CO LTD·Filed 2022·Granted Jan 27, 2026·0 cites·17 claims
- 4164US11873414B2Sealing resin composition, electronic component device, and method of manufacturing electronic component deviceSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Jan 16, 2024·0 cites·15 claims
- 4264US2023332026A1Photocurable composition, cured product of same, photofusible resin composition and adhesive setSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 4364US2023095879A1Method for using a buffer sheetSHOWA DENKO MATERIALS CO LTD·Filed 2022·Application pending·0 cites
- 4463US12363826B2Copper-clad laminate, printed wiring board, semiconductor package and method for producing copper-clad laminateSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Jul 15, 2025·0 cites·12 claims
- 4563US11682564B2Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulated molded body provided with temporary protective film, and method for manufacturing semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·22 claims
- 4663US11359114B2Polishing method using CMP polishing liquidSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Jun 14, 2022·0 cites·15 claims
- 4763US2023137299A1Electroconductive film, roll, connected structure, and process for producing connected structureSHOWA DENKO MATERIALS CO LTD·Filed 2022·Application pending·0 cites
- 4863US2021277483A1Molecular methods for assessing urothelial diseaseSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 4963US2023235205A1Adhesive set, film, bonded body, and method for separating adherendSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 5062US11691389B2Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin compositionSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Jul 4, 2023·0 cites·13 claims
Showing the top 50 of 220 patent records by PatentIndex Score.
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