Electroconductive film, roll, connected structure, and process for producing connected structure

Abstract

A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.

1 . A conductive film comprising:
 an elongated release film; and   a plurality of conductive adhesive film pieces which are provided on the release film,   wherein the plurality of adhesive film pieces are arranged in a longitudinal direction of the release film, and   wherein an end edge of the release film in a width direction of the release film and the adhesive film piece closest to the end edge are spaced apart from each other.   
     
     
         2 . The conductive film according to  claim 1 ,
 wherein each of the plurality of adhesive film pieces is provided with at least one hole.   
     
     
         3 . The conductive film according to  claim 1 ,
 wherein the plurality of adhesive film pieces are spaced in the longitudinal direction of the release film.   
     
     
         4 . The conductive film according to  claim 1 ,
 wherein the plurality of adhesive film pieces have the same shape.   
     
     
         5 . The conductive film according to  claim 1 ,
 wherein the plurality of adhesive film pieces are disposed at a center portion of the release film in a width direction.   
     
     
         6 . The conductive film according to  claim 1 ,
 wherein the plurality of adhesive film pieces are disposed at an end portion of the release film in a width direction.   
     
     
         7 . The conductive film according to any  claim 1 ,
 wherein the plurality of adhesive film pieces are also arranged in the width direction of the release film.   
     
     
         8 . The conductive film according to any  claim 1 ,
 wherein a gap of the plurality of adhesive film pieces in the longitudinal direction of the release film is 0.1 mm or more and 10 mm or less.   
     
     
         9 . The conductive film according to  claim 1 ,
 wherein a gap between an end edge of the release film and the adhesive film piece closest to the end edge in the width direction of the release film is 0.1 mm or more and 10 mm or less.   
     
     
         10 . The conductive film according to  claim 1 ,
 wherein the release film has light transmittance.   
     
     
         11 . The conductive film according to  claim 10 ,
 wherein transmittance of the release film is 15% or more and 100% or less.   
     
     
         12 . The conductive film according to  claim 10 ,
 wherein a haze value of the release film is 3% or more and 100% or less.   
     
     
         13 . The conductive film according to  claim 1 , further comprising:
 a second release film piece which is provided on the adhesive film piece.   
     
     
         14 . The conductive film according to  claim 1 ,
 wherein the adhesive film piece is formed such that conductive particles are dispersed in an adhesive.   
     
     
         15 . A wound body comprising:
 the conductive film according to  claim 1 ; and   a core on which the conductive film is wound.   
     
     
         16 . A connection structure comprising:
 a first circuit member that includes a first adhesive surface;   a second circuit member that includes a second adhesive surface; and   the adhesive film piece according to  claim 1  which connects the first adhesive surface and the second adhesive surface.   
     
     
         17 . A connection structure manufacturing method comprising:
 a film manufacturing step of manufacturing a conductive film in which a plurality of conductive adhesive film pieces are provided on an elongated release film and the plurality of adhesive film pieces are arranged in a longitudinal direction of the release film, and an end edge of the release film in a width direction of the release film and the adhesive film piece closest to the end edge are spaced apart from each other; and   a connection step of connecting a first adhesive surface of a first circuit member and a second adhesive surface of a second circuit member with the adhesive film piece of the conductive film interposed therebetween.   
     
     
         18 . The connection structure manufacturing method according to  claim 17 ,
 wherein the adhesive film piece is formed such that conductive particles are dispersed in an adhesive.   
     
     
         19 . The connection structure manufacturing method according to  claim 17 ,
 wherein the film manufacturing step includes an adhesive film layer forming step of forming a conductive adhesive film layer on an entire surface of the release film, an adhesive film layer cutting step of cutting the adhesive film layer along an outline forming an outer shape of the adhesive film piece, and a margin releasing step of releasing a margin portion corresponding to a portion other than the adhesive film piece in the adhesive film layer from the release film along the cut outline.   
     
     
         20 . The connection structure manufacturing method according to  claim 19 ,
 wherein the adhesive film layer is formed such that conductive particles are dispersed in an adhesive.   
     
     
         21 . The connection structure manufacturing method according to  claim 17 ,
 wherein the connection step includes a position detecting step of detecting a position of the adhesive film piece in the conductive film by an imaging device, an attachment step of attaching the adhesive film piece to the first adhesive surface on the basis of the position detected by the position detecting step, and an overlapping step of overlapping the first adhesive surface and the second adhesive surface with the adhesive film piece interposed therebetween.   
     
     
         22 . The connection structure manufacturing method according to  claim 17 ,
 wherein in the film manufacturing step, the conductive film is manufactured such that a second release film piece is provided on the adhesive film piece.   
     
     
         23 . The connection structure manufacturing method according to  claim 22 ,
 wherein the film manufacturing step includes an adhesive film layer forming step of forming a conductive adhesive film layer on an entire surface of the release film and covering an entire surface of the adhesive film layer with a second release film, an adhesive film layer cutting step of cutting the adhesive film layer and the second release film along an outline forming an outer shape of the adhesive film piece, and a margin releasing step of releasing a margin portion corresponding to a portion other than the adhesive film piece in the adhesive film layer and the second release film from the release film along the cut outline.   
     
     
         24 . The connection structure manufacturing method according to  claim 23 ,
 wherein the adhesive film layer is formed such that conductive particles are dispersed in an adhesive.   
     
     
         25 . The connection structure manufacturing method according to  claim 22 ,
 wherein the connection step includes a position detecting step of detecting a position of the adhesive film piece in the conductive film by an imaging device, an attachment step of attaching the adhesive film piece to the first adhesive surface on the basis of the position detected by the position detecting step, an overlapping step of overlapping the first adhesive surface and the second adhesive surface with the adhesive film piece interposed therebetween, and a second release film piece releasing step of releasing the second release film piece from the adhesive film piece before the attachment step.   
     
     
         26 . The connection structure manufacturing method according to  claim 21 ,
 wherein in the attachment step, the adhesive film piece is attached to the first adhesive surface and then the release film is released from the adhesive film piece.   
     
     
         27 . The connection structure manufacturing method according to  claim 21 ,
 wherein the connection step further includes a film cutting step of cutting the conductive film into a plurality of conductive film pieces in which one or the plurality of adhesive film pieces are provided in the release film before the position detecting step, and   wherein in the position detecting step, the position of the adhesive film piece of the conductive film piece is detected by the imaging device.   
     
     
         28 . The connection structure manufacturing method according to  claim 17 , further comprising providing at least one hole in each of the plurality of adhesive film pieces.