Curable composition and article

Abstract

A curable composition containing: a compound represented by the following formula (1):wherein R11 and R12 each independently represent a hydrogen atom or a methyl group, and R13 represents a divalent group having a polyoxyalkylene chain; and a thermally conductive filler.

1 . A curable composition comprising:
 a compound represented by the following formula (1):   
       
         
           
           
               
               
           
         
         wherein R 11  and R 12  each independently represent a hydrogen atom or a methyl group, and R 13  represents a divalent group having a polyoxyalkylene chain; and 
         a thermally conductive filler. 
       
     
     
         2 . The curable composition according to  claim 1 , wherein the polyoxyalkylene chain comprises a structural unit represented by the following formula (2): 
       
         
           
           
               
               
           
         
       
     
     
         3 . The curable composition according to  claim 1 , wherein the polyoxyalkylene chain comprises a structural unit represented by the following formula (3): 
       
         
           
           
               
               
           
         
       
     
     
         4 . The curable composition according to  claim 1 , wherein the polyoxyalkylene chain is a copolymer chain comprising a structural unit represented by the following formula (2) and a structural unit represented by the following formula (3): 
       
         
           
           
               
               
           
         
       
     
     
         5 . The curable composition according to  claim 4 , wherein the copolymer chain is a random copolymer chain. 
     
     
         6 . The curable composition according to  claim 1 , wherein the compound represented by the formula (1) has a weight average molecular weight of 5000 or more. 
     
     
         7 . The curable composition according to  claim 1 , wherein the polyoxyalkylene chain has 100 or more of oxyalkylene groups. 
     
     
         8 . The curable composition according to  claim 1 , wherein the compound represented by the formula (1) has a viscosity at 25° C. of 1000 Pa·s or less. 
     
     
         9 . The curable composition according to  claim 1 , further comprising an oxidation inhibitor. 
     
     
         10 . The curable composition according to  claim 9 , wherein the oxidation inhibitor is a phenol-based oxidation inhibitor. 
     
     
         11 . An article comprising:
 a heat source; and   a cured product of the curable composition according to  claim 1 , the cured product being provided to be thermally in contact with the heat source.