Inventor · disambiguated record
Shintaro Sugihara
Also filed as: SUGIHARA SHINTARO
4 granted patents·4 pending applications·9 citations·filing 2012–2024
66Inventor score
Technology areasH10P
Top patents by PatentIndex Score
8 records- 0176US9263268B2Joining device, joining system and joining methodTOKYO ELECTRON LTD·Filed 2014·Granted Feb 16, 2016·4 cites·13 claims
- 0268US9960069B2Joining device and joining systemTOKYO ELECTRON LTD·Filed 2014·Granted May 1, 2018·2 cites·9 claims
- 0367US9694572B2Bonding device and bonding systemTOKYO ELECTRON LTD·Filed 2014·Granted Jul 4, 2017·3 cites·9 claims
- 0456US11894246B2Bonding apparatus and bonding methodTOKYO ELECTRON LTD·Filed 2022·Granted Feb 6, 2024·0 cites·8 claims
- 0555US2024282617A1Substrate processing apparatus and substrate placing methodTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0642US2014208556A1Joining device and joining systemTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 0738US2013062013A1Joint apparatus, joint system, and joint methodOKADA SHINJI·Filed 2012·Application pending·0 cites
- 0838US2013133828A1Bonding apparatus, bonding system and bonding methodTOKYO ELECTRON LTD·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →