Inventor · disambiguated record
Shumpei Tanaka
Also filed as: TANAKA SHUMPEI
2 granted patents·4 pending applications·2 citations·filing 2010–2014
36Inventor score
Top patents by PatentIndex Score
6 records- 0154US9142457B2Dicing die bond film and method of manufacturing semiconductor deviceTANAKA SHUMPEI·Filed 2011·Granted Sep 22, 2015·2 cites·9 claims
- 0247US2015104649A1Laminated Sheet and Method of Manufacturing Semiconductor Device Using the Laminated SheetNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 0344US8951843B2Laminated sheet and method of manufacturing semiconductor device using the laminated sheetNITTO DENKO CORP·Filed 2012·Granted Feb 10, 2015·0 cites·3 claims
- 0431US2011256666A1Thermosetting die bond film, dicing die bond film and semiconductor deviceSUGO YUKI·Filed 2011·Application pending·0 cites
- 0531US2011189835A1Film for manufacturing semiconductor device and method of manufacturing semiconductor deviceSUGO YUKI·Filed 2011·Application pending·0 cites
- 0626US2011057331A1Thermosetting die bonding film, dicing die bonding film and semiconductor deviceHAYASHI MIKI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →