Inventor · disambiguated record
Sharon Huey Lin Tay
Also filed as: TAY SHARON HUEY LIN
2 granted patents·2 pending applications·3 citations·filing 2013–2023
45Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0172US11728308B2Semiconductor device under bump structure and method thereforNXP BV·Filed 2021·Granted Aug 15, 2023·1 cites·13 claims
- 0262US8698288B1Flexible substrate with crimping interconnectionLOW BOON YEW·Filed 2013·Granted Apr 15, 2014·2 cites·16 claims
- 0357US2023307402A1Semiconductor device under bump structure and method thereforNXP BV·Filed 2023·Application pending·0 cites
- 0444US2024014123A1Semiconductor device with lead-on-chip interconnect and method thereforNXP BV·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →