Inventor · disambiguated record
Shunsuke Teranishi
Also filed as: TERANISHI SHUNSUKE
18 granted patents·3 pending applications·2 citations·filing 2012–2025
85Inventor score
Top patents by PatentIndex Score
21 records- 0186US12383982B2Laminated device wafer forming methodDISCO CORP·Filed 2022·Granted Aug 12, 2025·1 cites·6 claims
- 0260US9190561B2Semiconductor light emitting element and light emitting deviceTERANISHI SHUNSUKE·Filed 2012·Granted Nov 17, 2015·1 cites·7 claims
- 0360US2024387229A1Method of manufacturing laminated assemblyDISCO CORP·Filed 2024·Application pending·0 cites
- 0459US12512314B2Processing method of waferDISCO CORP·Filed 2023·Granted Dec 30, 2025·0 cites·8 claims
- 0556US12424456B2Method of manufacturing package deviceDISCO CORP·Filed 2023·Granted Sep 23, 2025·0 cites·3 claims
- 0655US11764115B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Sep 19, 2023·0 cites·16 claims
- 0754US12300545B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted May 13, 2025·0 cites·18 claims
- 0854US11854891B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Dec 26, 2023·0 cites·19 claims
- 0954US11764114B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Sep 19, 2023·0 cites·17 claims
- 1054US11756831B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Sep 12, 2023·0 cites·19 claims
- 1153US2025285872A1Processing methodDISCO CORP·Filed 2025·Application pending·0 cites
- 1252US12322655B2Method of manufacturing layered device chip assemblyDISCO CORP·Filed 2022·Granted Jun 3, 2025·0 cites·3 claims
- 1352US12304109B2Method of separating waferDISCO CORP·Filed 2022·Granted May 20, 2025·0 cites·8 claims
- 1452US12198990B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Jan 14, 2025·0 cites·12 claims
- 1551US2024234154A9Method of processing waferDISCO CORP·Filed 2023·Application pending·0 cites
- 1649US12354995B2Laminated device chip manufacturing methodDISCO CORP·Filed 2022·Granted Jul 8, 2025·0 cites·6 claims
- 1749US12170224B2Method of processing waferDISCO CORP·Filed 2021·Granted Dec 17, 2024·0 cites·20 claims
- 1846US9048386B2Semiconductor light-emitting element and light-emitting deviceTOYODA GOSEI KK·Filed 2013·Granted Jun 2, 2015·0 cites·2 claims
- 1944US11456260B2Wafer processing methodDISCO CORP·Filed 2021·Granted Sep 27, 2022·0 cites·12 claims
- 2044US11417570B2Wafer processing methodDISCO CORP·Filed 2021·Granted Aug 16, 2022·0 cites·4 claims
- 2131US10249547B2Method for using a test wafer by forming modified layer using a laser beam and observing damage after forming modified layerDISCO CORP·Filed 2016·Granted Apr 2, 2019·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →