Inventor · disambiguated record
Shinichi Terashima
Also filed as: TERASHIMA SHINICHI
18 granted patents·7 pending applications·62 citations·filing 2001–2022
91Inventor score
Files withUNO TOMOHIRO5TERASHIMA SHINICHI4NIPPON STEEL & SUMIKIN MAT CO3NIPPON STEEL CORP3AKEBONO BRAKE IND2
Top patents by PatentIndex Score
25 records- 0185US8742258B2Bonding wire for semiconductorTERASHIMA SHINICHI·Filed 2010·Granted Jun 3, 2014·9 cites·15 claims
- 0276US8102061B2Semiconductor device bonding wire and wire bonding methodUNO TOMOHIRO·Filed 2008·Granted Jan 24, 2012·6 cites·10 claims
- 0373US8847390B2Lead-free solder bump bonding structureHASHINO EIJI·Filed 2013·Granted Sep 30, 2014·5 cites·5 claims
- 0472US9296180B2Metal foil for base materialTERASHIMA SHINICHI·Filed 2011·Granted Mar 29, 2016·1 cites·8 claims
- 0568US8247911B2Wire bonding structure and method for forming sameUNO TOMOHIRO·Filed 2008·Granted Aug 21, 2012·4 cites·26 claims
- 0667US9024442B2Solder ball for semiconductor packaging and electronic member using the sameTERASHIMA SHINICHI·Filed 2011·Granted May 5, 2015·3 cites·10 claims
- 0767US2024229206A1Fe-based amorphous alloy and fe-based amorphous alloy ribbonNIPPON STEEL CORP·Filed 2022·Application pending·0 cites
- 0865US7969021B2Bonding wire for semiconductor device and method for producing the sameNIPPON STEEL CORP·Filed 2001·Granted Jun 28, 2011·12 cites·35 claims
- 0962US9320152B2Solder ball and electronic memberNIPPON STEEL & SUMIKIN MAT CO·Filed 2014·Granted Apr 19, 2016·1 cites·12 claims
- 1061US9427830B2Copper alloy bonding wire for semiconductorUNO TOMOHIRO·Filed 2010·Granted Aug 30, 2016·1 cites·8 claims
- 1161US8815019B2Bonding wire for semiconductorUNO TOMOHIRO·Filed 2010·Granted Aug 26, 2014·1 cites·21 claims
- 1257US11198918B2Stainless steel foil and method of production of sameNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2015·Granted Dec 14, 2021·0 cites·9 claims
- 1357US7124858B2Brake systemAKEBONO BRAKE IND·Filed 2002·Granted Oct 24, 2006·13 cites·14 claims
- 1456US2015136209A1Polyimide layer-containing flexible substrate, polyimide layer-containing substrate for flexible solar cell, flexible solar cell, and method for producing sameNIPPON STEEL & SUMIKIN CHEM CO·Filed 2013·Application pending·0 cites
- 1555US7390370B2Gold bonding wires for semiconductor devices and method of producing the wiresNIPPON STEEL CORP·Filed 2003·Granted Jun 24, 2008·6 cites·22 claims
- 1652US12512771B2Power-generating magnetostrictive element and magnetostrictive power generation deviceNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2021·Granted Dec 30, 2025·0 cites·18 claims
- 1750US9112059B2Bonding wire for semiconductor deviceUNO TOMOHIRO·Filed 2012·Granted Aug 18, 2015·0 cites·21 claims
- 1850US8097960B2Semiconductor mounting bonding wireTERASHIMA SHINICHI·Filed 2008·Granted Jan 17, 2012·0 cites·17 claims
- 1940US11101234B2Cu pillar cylindrical preform for semiconductor connectionNIPPON MICROMETAL CORP·Filed 2015·Granted Aug 24, 2021·0 cites·10 claims
- 2039US9902134B2Metal foil for base material and producing method thereofKOBAYASHI TAKAYUKI·Filed 2011·Granted Feb 27, 2018·0 cites·20 claims
- 2139US2012038042A1Lead-free solder alloy, solder ball, and electronic member comprising solder bumpSASAKI TSUTOMU·Filed 2010·Application pending·0 cites
- 2238US2005000755A1Brake operating apparatusAKEBONO BRAKE IND·Filed 2004·Application pending·0 cites
- 2336US2002113322A1Semiconductor device and method to produce the sameFiled 2001·Application pending·0 cites
- 2434US2017209964A1Solder ball and electronic memberNIPPON STEEL & SUMIKIN MAT CO·Filed 2015·Application pending·0 cites
- 2528US2017259366A1Lead-free solder bump joining structureNIPPON STEEL & SUMIKIN MAT CO·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →