Inventor · disambiguated record
Shiban K. Tiku
Also filed as: TIKU SHIBAN K · TIKU SHIBAN KISHAN
17 granted patents·3 pending applications·270 citations·filing 1982–2025
94Inventor score
Top patents by PatentIndex Score
20 records- 0195US11222855B2Moisture barrier for bond pads and integrated circuit having the sameSKYWORKS SOLUTIONS INC·Filed 2020·Granted Jan 11, 2022·3 cites·27 claims
- 0294US11830826B2Moisture barrier for bond pads and integrated circuit having the sameSKYWORKS SOLUTIONS INC·Filed 2022·Granted Nov 28, 2023·2 cites·20 claims
- 0394US8022448B1Apparatus and methods for evaporation including test wafer holderSKYWORKS SOLUTIONS INC·Filed 2010·Granted Sep 20, 2011·32 cites·13 claims
- 0490US11387193B2Method of making moisture barrier for bond pads and integrated circuit having the sameSKYWORKS SOLUTIONS INC·Filed 2020·Granted Jul 12, 2022·2 cites·20 claims
- 0590US8415770B2Apparatus and methods for uniform metal platingRIEGE JENS A·Filed 2012·Granted Apr 9, 2013·14 cites·11 claims
- 0690US8188575B2Apparatus and method for uniform metal platingRIEGE JENS A·Filed 2010·Granted May 29, 2012·14 cites·26 claims
- 0787US2025364443A1Moisture barrier for metal insulator metal capacitors and integrated circuit having the sameSKYWORKS SOLUTIONS INC·Filed 2025·Application pending·0 cites
- 0886US4760369AThin film resistor and methodTEXAS INSTRUMENTS INC·Filed 1985·Granted Jul 26, 1988·49 cites·19 claims
- 0985US4482841AComposite dielectrics for low voltage electroluminescent displaysTEXAS INSTRUMENTS INC·Filed 1982·Granted Nov 13, 1984·45 cites·11 claims
- 1084US8481344B2Methods of evaporating metal onto a semiconductor wafer in a test wafer holderLUU LAM T·Filed 2011·Granted Jul 9, 2013·7 cites·25 claims
- 1181US6596635B1Method for metallization of a semiconductor substrateSKYWORKS SOLUTIONS INC·Filed 2002·Granted Jul 22, 2003·24 cites·23 claims
- 1277US9735249B2Gate structure with refractory metal barrierSKYWORKS SOLUTIONS INC·Filed 2016·Granted Aug 15, 2017·2 cites·20 claims
- 1369US9422621B2Refractory metal barrier in semiconductor devicesSKYWORKS SOLUTIONS INC·Filed 2014·Granted Aug 23, 2016·2 cites·19 claims
- 1465US12406944B2Moisture barrier for metal insulator metal capacitors and integrated circuit having the sameSKYWORKS SOLUTIONS INC·Filed 2020·Granted Sep 2, 2025·0 cites·20 claims
- 1563US6614117B1Method for metallization of a semiconductor substrate and related structureSKYWORKS SOLUTIONS INC·Filed 2002·Granted Sep 2, 2003·9 cites·13 claims
- 1663US4843033AMethod for outdiffusion of zinc into III-V substrates using zinc tungsten silicide as dopant sourceTEXAS INSTRUMENTS INC·Filed 1987·Granted Jun 27, 1989·28 cites·17 claims
- 1763US2021118821A1Method of making a moisture barrier for metal insulator metal capacitors in integrated circuitsSKYWORKS SOLUTIONS INC·Filed 2020·Application pending·0 cites
- 1859US4632713AProcess of making Schottky barrier devices formed by diffusion before contactingTEXAS INSTRUMENTS INC·Filed 1985·Granted Dec 30, 1986·17 cites·7 claims
- 1959US2024255562A1Systems and methods for estimating quiescent current in power amplifier dieSKYWORKS SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 2050US4672414APlanar heterojunction bipolar device and methodTEXAS INSTRUMENTS INC·Filed 1985·Granted Jun 9, 1987·20 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →