Inventor · disambiguated record
Shuang-Ji Tsai
Also filed as: TSAI SHUANG-JI
47 granted patents·8 pending applications·226 citations·filing 2011–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD29TAIWAN SEMICONDUCTOR MFG13TSAI SHUANG-JI6LIN JENG-SHYAN4CHUANG CHUN-CHIEH2
Top patents by PatentIndex Score
55 records- 0198US8736006B1Backside structure for a BSI image sensor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 27, 2014·31 cites·20 claims
- 0296US9972603B2Seal-ring structure for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 15, 2018·19 cites·20 claims
- 0395US11011567B2Structure and method for 3D image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 18, 2021·3 cites·20 claims
- 0495US10777539B2Seal-ring structure for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 15, 2020·9 cites·20 claims
- 0593US9305966B2Backside structure and method for BSI image sensorsTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Apr 5, 2016·5 cites·20 claims
- 0693US8941204B2Apparatus and method for reducing cross talk in image sensorsLIN JENG-SHYAN·Filed 2012·Granted Jan 27, 2015·10 cites·20 claims
- 0793US8709854B2Backside structure and methods for BSI image sensorsCHUANG CHUN-CHIEH·Filed 2012·Granted Apr 29, 2014·14 cites·11 claims
- 0893US8628990B1Image device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jan 14, 2014·9 cites·19 claims
- 0993US8435824B2Backside illumination sensor having a bonding pad structure and method of making the sameTSAI SHUANG-JI·Filed 2011·Granted May 7, 2013·18 cites·20 claims
- 1092US9224770B2Image sensor device and methodLIN JENG-SHYAN·Filed 2012·Granted Dec 29, 2015·7 cites·20 claims
- 1191US9287312B2Imaging sensor structure and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 15, 2016·7 cites·20 claims
- 1290US9627430B2Method and apparatus for low resistance image sensor contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 18, 2017·3 cites·20 claims
- 1390US9165970B2Back side illuminated image sensor having isolated bonding padsTSAI SHUANG-JI·Filed 2011·Granted Oct 20, 2015·8 cites·17 claims
- 1490US9041206B2Interconnect structure and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 26, 2015·11 cites·20 claims
- 1589US10566378B2Back side illuminated image sensor with reduced sidewall-induced leakageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 18, 2020·4 cites·20 claims
- 1689US9570497B2Back side illuminated image sensor having isolated bonding padsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 14, 2017·4 cites·19 claims
- 1788US9059061B2Structure and method for 3D image sensorTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 16, 2015·3 cites·20 claims
- 1887US9013022B2Pad structure including glue layer and non-low-k dielectric layer in BSI image sensor chipsLIN JENG-SHYAN·Filed 2011·Granted Apr 21, 2015·7 cites·21 claims
- 1987US8969991B2Backside structure and methods for BSI image sensorsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 3, 2015·8 cites·20 claims
- 2086US11476295B2Back side illuminated image sensor with reduced sidewall-induced leakageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 18, 2022·2 cites·20 claims
- 2186US10475772B2Seal-ring structure for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 12, 2019·3 cites·20 claims
- 2286US9184207B2Pad structures formed in double openings in dielectric layersTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Nov 10, 2015·2 cites·20 claims
- 2385US9455288B2Image sensor structure to reduce cross-talk and improve quantum efficiencyTSAI SHUANG-JI·Filed 2012·Granted Sep 27, 2016·4 cites·19 claims
- 2485US8952497B2Scribe lines in wafersCHEN U-TING·Filed 2012·Granted Feb 10, 2015·8 cites·20 claims
- 2585US2024421177A1Back side illuminated image sensor with reduced sidewall-induced leakageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2684US2025359378A1Image sensor structure for crosstalk reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2783US9245912B2Method and apparatus for low resistance image sensor contactTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 26, 2016·2 cites·20 claims
- 2882US9837464B2Backside structure and methods for BSI image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 5, 2017·2 cites·20 claims
- 2981US10157895B2Seal-ring structure for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 18, 2018·2 cites·20 claims
- 3081US9525003B2Structure and method for 3D image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 20, 2016·2 cites·20 claims
- 3180US8946849B2BSI image sensor chips with separated color filters and methods for forming the sameTSAI SHUANG-JI·Filed 2012·Granted Feb 3, 2015·2 cites·20 claims
- 3279US9401380B2Backside structure and methods for BSI image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 26, 2016·1 cites·20 claims
- 3378US9576999B2Backside structure and methods for BSI image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 21, 2017·2 cites·20 claims
- 3478US8710612B2Semiconductor device having a bonding pad and shield structure of different thicknessTSAI SHUANG-JI·Filed 2011·Granted Apr 29, 2014·4 cites·12 claims
- 3578US2025348648A1Bonded Semiconductor Device And Method For Forming The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3677US8987855B2Pad structures formed in double openings in dielectric layersLIN JENG-SHYAN·Filed 2011·Granted Mar 24, 2015·1 cites·20 claims
- 3776US9356058B2Backside structure for BSI image sensorCHUANG CHUN-CHIEH·Filed 2012·Granted May 31, 2016·1 cites·20 claims
- 3875US11901396B2Back side illuminated image sensor with reduced sidewall-induced leakageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 3974US10062728B2Image sensor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 28, 2018·1 cites·20 claims
- 4074US2023369366A1Enhanced design for image sensing technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4171US9653508B2Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 16, 2017·1 cites·20 claims
- 4271US9142690B2Semiconductor device having a bonding pad and shield structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 22, 2015·2 cites·20 claims
- 4371US8664736B2Bonding pad structure for a backside illuminated image sensor device and method of manufacturing the sameTSAI SHUANG-JI·Filed 2011·Granted Mar 4, 2014·3 cites·15 claims
- 4470US2023352508A1Image sensor structure for crosstalk reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4569US9613996B2Backside structure and methods for BSI image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 4, 2017·1 cites·20 claims
- 4666US11923392B2Enhanced design for image sensing technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 4762US9147702B2Image sensor for mitigating dark currentTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 29, 2015·0 cites·20 claims
- 4862US2022277127A1Bonded Semiconductor Device And Method For Forming The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 4960US10535697B2Structure and method for 3D Image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 14, 2020·0 cites·20 claims
- 5060US2025308983A1Semiconductor device and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →