Inventor · disambiguated record
Shiro Uchiyama
Also filed as: UCHIYAMA SHIRO
17 granted patents·7 pending applications·134 citations·filing 2006–2024
93Inventor score
Top patents by PatentIndex Score
24 records- 0195US7323785B2Semiconductor deviceELPIDA MEMORY INC·Filed 2006·Granted Jan 29, 2008·43 cites·19 claims
- 0291US9997452B1Forming conductive plugs for memory deviceMICRON TECHNOLOGY INC·Filed 2017·Granted Jun 12, 2018·7 cites·14 claims
- 0391US7732926B2Semiconductor device having a through electrode with a low resistance and method of manufacturing the sameELPIDA MEMORY INC·Filed 2006·Granted Jun 8, 2010·27 cites·27 claims
- 0488US8704352B2Semiconductor device having a liquid cooling moduleHISANO NAE·Filed 2010·Granted Apr 22, 2014·11 cites·18 claims
- 0588US8004090B2Semiconductor device and method for manufacturing the sameELPIDA MEMORY INC·Filed 2008·Granted Aug 23, 2011·15 cites·10 claims
- 0688US7943470B2Chip-stacked semiconductor device and manufacturing method thereofELPIDA MEMORY INC·Filed 2008·Granted May 17, 2011·15 cites·15 claims
- 0777US8722502B2Chip-stacked semiconductor device and manufacturing method thereofUCHIYAMA SHIRO·Filed 2011·Granted May 13, 2014·4 cites·23 claims
- 0873US11380665B2Semiconductor dice assemblies, packages and systems, and methods of operationMICRON TECHNOLOGY INC·Filed 2019·Granted Jul 5, 2022·1 cites·21 claims
- 0973US8536711B2Chip-stacked semiconductor and manufacturing method thereofUCHIYAMA SHIRO·Filed 2011·Granted Sep 17, 2013·3 cites·20 claims
- 1072US10600770B2Semiconductor dice assemblies, packages and systems, and methods of operationMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 24, 2020·1 cites·13 claims
- 1171US2024234378A1Semiconductor assemblies with system and methods for aligning dies using registration marksMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1268US8937390B2Semiconductor device having a liquid cooling moduleHISANO NAE·Filed 2014·Granted Jan 20, 2015·2 cites·2 claims
- 1367US11955461B2Semiconductor assemblies with system and methods for aligning dies using registration marksMICRON TECHNOLOGY INC·Filed 2021·Granted Apr 9, 2024·0 cites·9 claims
- 1464US7897459B2Semiconductor device and manufacturing method thereofELPIDA MEMORY INC·Filed 2007·Granted Mar 1, 2011·3 cites·10 claims
- 1562US10896875B2Forming conductive plugs for memory deviceMICRON TECHNOLOGY INC·Filed 2019·Granted Jan 19, 2021·0 cites·21 claims
- 1662US7842610B2Semiconductor deviceELPIDA MEMORY INC·Filed 2007·Granted Nov 30, 2010·2 cites·20 claims
- 1760US2024421040A1Apparatus including tsv structureMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1858US10438888B2Forming conductive plugs for memory deviceMICRON TECHNOLOGY INC·Filed 2018·Granted Oct 8, 2019·0 cites·16 claims
- 1952US2023215828A1Layouts of data pads on a semiconductor dieMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 2050US8334465B2Wafer of circuit board and joining structure of wafer or circuit boardISHINO MASAKAZU·Filed 2008·Granted Dec 18, 2012·0 cites·24 claims
- 2149US2013140067A1Wafer or circuit board and joining structure of wafer or circuit boardELPIDA MEMORY INC·Filed 2012·Application pending·0 cites
- 2246US2009134498A1Semiconductor apparatusELPIDA MEMORY INC·Filed 2008·Application pending·0 cites
- 2344US2008237806A1Through-electrode and semiconductor deviceELPIDA MEMORY INC·Filed 2008·Application pending·0 cites
- 2441US2007284634A1Semiconductor device and method of manufacturing the sameELPIDA MEMORY INC·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →