Inventor · disambiguated record
Shuhei Ueda
Also filed as: UEDA SHUHEI
17 granted patents·6 pending applications·254 citations·filing 1996–2025
92Inventor score
Top patents by PatentIndex Score
23 records- 0196US11417799B2Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plateSEMILEDS CORP·Filed 2020·Granted Aug 16, 2022·4 cites·20 claims
- 0296US5866634ABiodegradable polymer compositions and shrink filmsSHINETSU CHEMICAL CO·Filed 1996·Granted Feb 2, 1999·155 cites·12 claims
- 0393US5726220ABiodegradable polymer compositions and shrink filmsSHINETSU CHEMICAL CO·Filed 1996·Granted Mar 10, 1998·78 cites·10 claims
- 0486US2024072203A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSEMILEDS CORP·Filed 2023·Application pending·0 cites
- 0585US2024063339A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSAMILEDS CORP·Filed 2023·Application pending·0 cites
- 0681US11862755B2Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plateSEMILEDS CORP·Filed 2022·Granted Jan 2, 2024·0 cites·5 claims
- 0780US11862754B2Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plateSEMILEDS CORP·Filed 2022·Granted Jan 2, 2024·0 cites·4 claims
- 0873US7183210B2Method for preparing large-size substrateSHINETSU CHEMICAL CO·Filed 2005·Granted Feb 27, 2007·6 cites·7 claims
- 0972US12342467B2Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated componentSHINETSU CHEMICAL CO·Filed 2019·Granted Jun 24, 2025·1 cites·42 claims
- 1072US7608542B2Large-size glass substrate for photomask and making method, computer-readable recording medium, and mother glass exposure methodSHINETSU CHEMICAL CO·Filed 2006·Granted Oct 27, 2009·4 cites·16 claims
- 1172US2025287559A1Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated componentSHINETSU CHEMICAL CO·Filed 2025·Application pending·0 cites
- 1268US7745071B2Large-sized glass substrateSHINETSU CHEMICAL CO·Filed 2007·Granted Jun 29, 2010·2 cites·6 claims
- 1366US9919962B2Polishing agent for synthetic quartz glass substrateSHINETSU CHEMICAL CO·Filed 2014·Granted Mar 20, 2018·0 cites·11 claims
- 1465US7906256B2Recycling of large-size photomask substrateSHINETSU CHEMICAL CO·Filed 2007·Granted Mar 15, 2011·2 cites·7 claims
- 1559US2010243950A1Polishing agent for synthetic quartz glass substrateHARADA DAIJITSU·Filed 2009·Application pending·0 cites
- 1654US12421164B2Substrate for transferring microstructures and method for manufacturing the sameSHINETSU CHEMICAL CO·Filed 2021·Granted Sep 23, 2025·0 cites·20 claims
- 1753US2023018855A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSEMILEDS CORP·Filed 2022·Application pending·0 cites
- 1852US7191618B2Large-sized substrate and method of producing the sameSHINETSU CHEMICAL CO·Filed 2003·Granted Mar 20, 2007·2 cites·11 claims
- 1951US10281612B2Methods for working and sensing synthetic quartz glass substrateSHINETSU CHEMICAL CO·Filed 2017·Granted May 7, 2019·0 cites·14 claims
- 2051US9599746B2Methods for working and sensing synthetic quartz glass substrateSHINETSU CHEMICAL CO·Filed 2015·Granted Mar 21, 2017·0 cites·8 claims
- 2150US10680139B2Window member for optical device package, optical device package, making methods, and optical device-mountable packageSHINETSU CHEMICAL CO·Filed 2017·Granted Jun 9, 2020·0 cites·22 claims
- 2250US10065285B2Method of preparing substrateSHINETSU CHEMICAL CO·Filed 2012·Granted Sep 4, 2018·0 cites·5 claims
- 2346US2022315418A1Method for transferring microstructures, and method for mounting microstructuresSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →