Inventor · disambiguated record
Shih-Che Wang
Also filed as: WANG SHIH-CHE
17 granted patents·8 pending applications·143 citations·filing 1998–2025
91Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD16TAIWAN SEMICONDUCTOR MFG6UNITED MICROELECTRONICS CORP2WANG HSIEN-CHENG1
Top patents by PatentIndex Score
25 records- 0189US6420791B1Alignment mark designUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jul 16, 2002·111 cites·16 claims
- 0281US10558120B2System and method for supplying and dispensing bubble-free photolithography chemical solutionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 11, 2020·2 cites·20 claims
- 0381US2025316479A1Method and apparatus for coating photo resist over a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0479US12362179B2Method and apparatus for coating photo resist over a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 0578US2023384680A1System and method for supplying and dispensing bubble-free photolithography chemical solutionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0674US12001132B2Protection layer on low thermal expansion material (LTEM) substrate of extreme ultraviolet (EUV) maskTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 4, 2024·1 cites·23 claims
- 0772US11955335B2Method and apparatus for coating photo resist over a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 9, 2024·0 cites·17 claims
- 0872US7838173B2Structure design and fabrication on photomask for contact hole manufacturing process window enhancementTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 23, 2010·3 cites·22 claims
- 0971US2024382994A1Method and apparatus for reducing solvent consumptionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1069US10795270B2Methods of defect inspectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 6, 2020·1 cites·19 claims
- 1167US8416393B2Cross quadrupole double lithography method and apparatus for semiconductor device fabrication using two aperturesWANG HSIEN-CHENG·Filed 2009·Granted Apr 9, 2013·2 cites·19 claims
- 1267US2022365414A1Protection layer on low thermal expansion material (ltem) substrate of extreme ultraviolet (euv) maskTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1366US12025917B2System and method for supplying and dispensing bubble-free photolithography chemical solutionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 2, 2024·0 cites·20 claims
- 1464US2023043243A1Method and apparatus for solvent recyclingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1563US11798800B2Method and apparatus for solvent recyclingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 24, 2023·0 cites·20 claims
- 1661US11624985B2Methods of defect inspectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 11, 2023·0 cites·20 claims
- 1757US9817315B2System and method for supplying and dispensing bubble-free photolithography chemical solutionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 14, 2017·0 cites·20 claims
- 1852US7338909B2Micro-etching method to replicate alignment marks for semiconductor wafer photolithographyTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Mar 4, 2008·5 cites·42 claims
- 1952US6080659AMethod to form an alignment markUNITED MICROELECTRONICS CORP·Filed 1998·Granted Jun 27, 2000·18 cites·7 claims
- 2051US9280041B2Cross quadrupole double lithography method using two complementary aperturesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 8, 2016·0 cites·14 claims
- 2146US11545361B2Method and apparatus for coating photo resist over a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 3, 2023·0 cites·16 claims
- 2244US10274818B2Lithography patterning with sub-resolution assistant patterns and off-axis illuminationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·0 cites·20 claims
- 2339US2006000109A1Method and apparatus for reducing spin-induced wafer chargingTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 2438US2006094131A1System and method for critical dimension control in semiconductor manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 2536US2011193202A1Methods to achieve 22 nanometer and beyond with single exposureTAIWAN SEMICONDUCTOR MFG·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →