Inventor · disambiguated record
Shuangshuang Wu
Also filed as: WU SHUANGSHUANG
6 granted patents·14 pending applications·1 citations·filing 2017–2024
65Inventor score
Files withCHANGXIN MEMORY TECH INC9YANGTZE MEMORY TECH CO LTD7CXMT CORP2PING AN TECH SHENZHEN CO LTD1SHANGHAI BIREN TECHNOLOGY CO LTD1
Top patents by PatentIndex Score
20 records- 0181US12412790B2Semiconductor structure, memory, and crack testing methodCHANGXIN MEMORY TECH INC·Filed 2022·Granted Sep 9, 2025·1 cites·14 claims
- 0262US2025096162A1Semiconductor structure and manufacturing method thereforCXMT CORP·Filed 2024·Application pending·0 cites
- 0362US2025323089A1Isolation structures in semiconductor devicesYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0460US2025201746A1Semiconductor structure and manufacturing method thereforCXMT CORP·Filed 2024·Application pending·0 cites
- 0559US2025056798A1Semiconductor structure and fabrication method thereof, three-dimensional memoryYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 0659US2025366141A1Managing top select gates in semiconductor devicesYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0756US2023225124A1Three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
- 0854US2024215239A1Gate line structure to reduce wafer bowYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
- 0953US2024188292A1Three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
- 1052US2024074181A1Three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
- 1151US12243779B2Semiconductor structure and method for manufacturing semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Mar 4, 2025·0 cites·3 claims
- 1249US2022359290A1Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Application pending·0 cites
- 1348US2024037179A1Data processing method and apparatusSHANGHAI BIREN TECHNOLOGY CO LTD·Filed 2022·Application pending·0 cites
- 1448US2018307948A1Method and device of constructing decision model, computer device and storage apparatusPING AN TECH SHENZHEN CO LTD·Filed 2017·Application pending·0 cites
- 1547US11882686B2Capacitor and forming method thereof, and DRAM and forming method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jan 23, 2024·0 cites·15 claims
- 1646US12424519B2Semiconductor structure, method for manufacturing semiconductor structure, and memoryCHANGXIN MEMORY TECH INC·Filed 2022·Granted Sep 23, 2025·0 cites·14 claims
- 1745US11955511B2Semiconductor structure and method for manufacturing semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Apr 9, 2024·0 cites·13 claims
- 1845US11901405B2Semiconductor structure and method for manufacturing semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Feb 13, 2024·0 cites·15 claims
- 1944US2023024544A1Semiconductor structure, method of forming semiconductor structure, and memoryCHANGXIN MEMORY TECH INC·Filed 2022·Application pending·0 cites
- 2041US2023015307A1Semiconductor structure fabrication method, semiconductor structure and memoryCHANGXIN MEMORY TECH INC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →