Inventor · disambiguated record
Shusaku Yanagawa
Also filed as: YANAGAWA SHUSAKU
28 granted patents·9 pending applications·120 citations·filing 1995–2021
95Inventor score
Top patents by PatentIndex Score
37 records- 0189US11296136B2Imaging apparatus and manufacturing method for imaging apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Apr 5, 2022·5 cites·20 claims
- 0285US10410884B2Wiring substrate, method of manufacturing wiring substrate, component-embedded glass substrate, and method of manufacturing component-embedded glass substrateSONY CORP·Filed 2017·Granted Sep 10, 2019·4 cites·20 claims
- 0385US8254144B2Circuit board laminated module and electronic equipmentMATSUMOTO KATSUJI·Filed 2010·Granted Aug 28, 2012·14 cites·8 claims
- 0485US6562736B2Manufacturing method for semiconductor deviceSONY CORP·Filed 2001·Granted May 13, 2003·37 cites·6 claims
- 0584US8482107B2Circular shield of a circuit-substrate laminated module and electronic apparatusROKUHARA SHINJI·Filed 2010·Granted Jul 9, 2013·10 cites·15 claims
- 0682US8395230B2Semiconductor device and method of manufacturing the sameHOZUMI HIROKI·Filed 2009·Granted Mar 12, 2013·9 cites·14 claims
- 0780US9929199B2Radiation detector, imaging unit, and imaging and display systemSONY CORP·Filed 2014·Granted Mar 27, 2018·5 cites·17 claims
- 0875US8106447B2Semiconductor device and method of manufacturing the sameHOZUMI HIROKI·Filed 2009·Granted Jan 31, 2012·5 cites·8 claims
- 0974US9257395B2Semiconductor deviceSONY CORP·Filed 2014·Granted Feb 9, 2016·3 cites·11 claims
- 1071US10763286B2Semiconductor device, manufacturing method thereof, and electronic apparatusSONY CORP·Filed 2016·Granted Sep 1, 2020·2 cites·16 claims
- 1170US9723724B2Wiring substrate, method of manufacturing wiring substrate, component-embedded glass substrate, and method of manufacturing component-embedded glass substrateSONY CORP·Filed 2014·Granted Aug 1, 2017·2 cites·8 claims
- 1261US10634862B2Optical communication device, reception apparatus, transmission apparatus, and transmission and reception systemSONY CORP·Filed 2018·Granted Apr 28, 2020·0 cites·15 claims
- 1360US10483413B2Photoelectric module and optical deviceSONY CORP·Filed 2015·Granted Nov 19, 2019·1 cites·16 claims
- 1459US8338912B2Inductor module, silicon tuner module and semiconductor deviceOKA SHUICHI·Filed 2009·Granted Dec 25, 2012·2 cites·3 claims
- 1558US9614347B2Optical communication device, reception apparatus, transmission apparatus, and transmission and reception systemSONY CORP·Filed 2014·Granted Apr 4, 2017·0 cites·15 claims
- 1657US10168498B2Optical communication device, reception apparatus, transmission apparatus, and transmission and reception systemSONY CORP·Filed 2017·Granted Jan 1, 2019·0 cites·6 claims
- 1755US12294152B2Radio frequency module and wireless deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted May 6, 2025·0 cites·15 claims
- 1855US6787457B2Method of etching and anti-reflection film using substituted hydrocarbon with halogen gasSONY CORP·Filed 2002·Granted Sep 7, 2004·7 cites·5 claims
- 1953US11984639B2Antenna device and wireless communication apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted May 14, 2024·0 cites·14 claims
- 2052US11527494B2Module and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Dec 13, 2022·0 cites·12 claims
- 2149US12140750B2Light reflecting element and spatial light modulatorSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Nov 12, 2024·0 cites·20 claims
- 2249US11355465B2Semiconductor device including glass substrate having improved reliability and method of manufacturing the sameSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Jun 7, 2022·0 cites·17 claims
- 2349US2013029466A1Semiconductor device and method of manufacturing the sameSONY CORP·Filed 2012·Application pending·0 cites
- 2448US6923867B2Substrate processing apparatus and method for manufacturing semiconductor deviceSONY CORP·Filed 2002·Granted Aug 2, 2005·2 cites·10 claims
- 2547US11417584B2Semiconductor deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Aug 16, 2022·0 cites·16 claims
- 2646US5843848AMethod of plasma etchingSONY CORP·Filed 1995·Granted Dec 1, 1998·12 cites·13 claims
- 2746US2013149464A1Method of manufacturing circuit boardSONY CORP·Filed 2012·Application pending·0 cites
- 2846US2012119288A1Semiconductor device and method of manufacturing the sameHOZUMI HIROKI·Filed 2012·Application pending·0 cites
- 2944US2015047971A1Sputtering target, method of manufacturing sputtering target, method of manufacturing barium titanate thin film, and method of manufacturing thin film capacitorSONY CORP·Filed 2013·Application pending·0 cites
- 3043US2013154146A1Sintering machine and method of manufacturing sintered bodySONY CORP·Filed 2012·Application pending·0 cites
- 3142US10061036B2Radiation detector, method of manufacturing radiation detector, and imaging apparatusSONY CORP·Filed 2016·Granted Aug 28, 2018·0 cites·16 claims
- 3241US2021286170A1Semiconductor device, display unit, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2017·Application pending·0 cites
- 3339US10256117B2Manufacturing method and wiring substrate with through electrodeSONY CORP·Filed 2016·Granted Apr 9, 2019·0 cites·13 claims
- 3439US9672983B2Peel resistant multilayer wiring board with thin film capacitor and manufacturing method thereofOKA SHUICHI·Filed 2012·Granted Jun 6, 2017·0 cites·6 claims
- 3539US2007247268A1Inductor element and method for production thereof, and semiconductor module with inductor elementOYA YOICHI·Filed 2007·Application pending·0 cites
- 3636US2019049599A1Imaging apparatus, imaging display system, and display apparatusSONY CORP·Filed 2017·Application pending·0 cites
- 3735US2012241204A1Thin film capacitor, mounting substrate, and method of manufacturing the mounting substrateMATSUMOTO KATSUJI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →