Inventor · disambiguated record
Shu-Shen Yeh
Also filed as: Yeh Shu-Shen
129 granted patents·67 pending applications·104 citations·filing 2015–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD196
Top patents by PatentIndex Score
196 records- 0198US11749644B2Semiconductor device with curved conductive lines and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 5, 2023·5 cites·20 claims
- 0298US11264359B2Chip bonded to a redistribution structure with curved conductive linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·10 cites·20 claims
- 0397US11967582B2Multi-chip device and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 23, 2024·2 cites·20 claims
- 0497US11784130B2Structure and formation method of package with underfillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 10, 2023·3 cites·20 claims
- 0597US11637087B2Multi-chip device and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 25, 2023·3 cites·20 claims
- 0696US12040267B2Organic interposer including intra-die structural reinforcement structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 16, 2024·2 cites·20 claims
- 0795US12300568B2High efficiency heat dissipation using discrete thermal interface material filmsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 13, 2025·2 cites·20 claims
- 0895US11854929B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
- 0995US11823991B2Frames stacked on substrate encircling devices and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 21, 2023·2 cites·20 claims
- 1095US11798897B2Package structure and methods of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 24, 2023·2 cites·20 claims
- 1194US12255156B2Semiconductor package with riveting structure between two rings and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·1 cites·20 claims
- 1294US11984378B2Semiconductor package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 14, 2024·2 cites·20 claims
- 1394US11915991B2Semiconductor device having first heat spreader and second heat spreader and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 27, 2024·2 cites·20 claims
- 1494US11908757B2Die corner removal for molding compound crack suppression in semiconductor die packaging and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·2 cites·20 claims
- 1594US11699668B2Semiconductor device package having warpage control and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 11, 2023·2 cites·20 claims
- 1694US11594477B2Semiconductor package and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 28, 2023·2 cites·20 claims
- 1794US9870975B1Chip package with thermal dissipation structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 16, 2018·12 cites·20 claims
- 1893US12322703B2Eccentric via structures for stress reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 3, 2025·1 cites·20 claims
- 1993US11854956B2Semiconductor die package with conductive line crack prevention designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
- 2093US11830800B2Metallization structure and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 28, 2023·2 cites·20 claims
- 2193US11784061B2Chip package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 10, 2023·2 cites·20 claims
- 2293US11574861B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 7, 2023·2 cites·20 claims
- 2393US11450622B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 20, 2022·2 cites·20 claims
- 2491US11610835B2Organic interposer including intra-die structural reinforcement structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 21, 2023·2 cites·20 claims
- 2591US9721868B2Three dimensional integrated circuit (3DIC) having a thermally enhanced heat spreader embedded in a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 1, 2017·9 cites·20 claims
- 2691US2025364488A1Multi-chip device and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2790US11328971B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 10, 2022·2 cites·20 claims
- 2890US11011447B2Semiconductor package and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 18, 2021·4 cites·20 claims
- 2987US12394752B2Multi-chip device and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 3087US11894320B2Semiconductor device package with stress reduction design and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·1 cites·20 claims
- 3187US11715731B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 1, 2023·1 cites·20 claims
- 3287US11694974B2Semiconductor die with warpage release layer structure in package and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 4, 2023·1 cites·20 claims
- 3387US2025357368A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3486US12489027B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 2, 2025·0 cites·20 claims
- 3586US12183714B2Package structures and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 31, 2024·1 cites·20 claims
- 3686US11742322B2Integrated fan-out package having stress release structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·1 cites·20 claims
- 3786US10276551B2Semiconductor device package and method of forming semiconductor device packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·3 cites·14 claims
- 3886US2025309141A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3986US2025300036A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4086US2025349687A1Package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4185US12354928B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 4285US12347793B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 4385US12347764B2Organic interposer including intra-die structural reinforcement structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 4485US12300632B2Chip package with lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 4585US12278156B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 4685US2025293143A1Organic interposer including intra-die structural reinforcement structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4784US12444696B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 4884US12387991B2Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 4984US12362197B2Semiconductor die package with ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 5084US11652037B2Semiconductor package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 16, 2023·1 cites·20 claims
Showing the top 50 of 196 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →