Inventor · disambiguated record
Shunya Yokosawa
Also filed as: YOKOSAWA SHUNYA
2 granted patents·1 pending application·8 citations·filing 2010–2012
54Inventor score
Files withNAKAKO HIDEO3
Top patents by PatentIndex Score
3 records- 0182US9457406B2Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid compositionNAKAKO HIDEO·Filed 2010·Granted Oct 4, 2016·5 cites·13 claims
- 0280US9676969B2Composition set, conductive substrate and method of producing the same, and conductive adhesive compositionNAKAKO HIDEO·Filed 2012·Granted Jun 13, 2017·3 cites·18 claims
- 0339US2012170241A1Printing ink, metal nanoparticles used in the same, wiring, circuit board, and semiconductor packageNAKAKO HIDEO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →