Inventor · disambiguated record
Shan-Pu Yu
Also filed as: YU SHAN-PU
13 granted patents·6 pending applications·194 citations·filing 2004–2023
92Inventor score
Top patents by PatentIndex Score
19 records- 0197US7294920B2Wafer-leveled chip packaging structure and method thereofIND TECH RES INST·Filed 2005·Granted Nov 13, 2007·92 cites·5 claims
- 0292US7528009B2Wafer-leveled chip packaging structure and method thereofIND TECH RES INST·Filed 2007·Granted May 5, 2009·20 cites·18 claims
- 0387US7411306B2Packaging structure and method of an image sensor moduleIND TECH RES INST·Filed 2005·Granted Aug 12, 2008·17 cites·11 claims
- 0482US7091592B2Stacked package for electronic elements and packaging method thereofIND TECH RES INST·Filed 2004·Granted Aug 15, 2006·30 cites·18 claims
- 0581US7572676B2Packaging structure and method of an image sensor moduleIND TECH RES INST·Filed 2007·Granted Aug 11, 2009·10 cites·12 claims
- 0680US8314482B2Semiconductor package deviceCHEN SHOU-LUNG·Filed 2007·Granted Nov 20, 2012·8 cites·20 claims
- 0778US7544529B2Image sensor packaging structure and method of manufacturing the sameIND TECH RES INST·Filed 2007·Granted Jun 9, 2009·7 cites·8 claims
- 0873US7417293B2Image sensor packaging structureIND TECH RES INST·Filed 2005·Granted Aug 26, 2008·5 cites·17 claims
- 0971US9059181B2Wafer leveled chip packaging structure and method thereofINVENSAS CORP·Filed 2013·Granted Jun 16, 2015·2 cites·14 claims
- 1064US8587091B2Wafer-leveled chip packaging structure and method thereofCHEN SHOU-LUNG·Filed 2012·Granted Nov 19, 2013·1 cites·4 claims
- 1163US7754599B2Structure for reducing stress for vias and fabricating method thereofIND TECH RES INST·Filed 2009·Granted Jul 13, 2010·2 cites·11 claims
- 1262US2025127996A1Injection needle device with safe-protection functionYU SHAN PU·Filed 2023·Application pending·0 cites
- 1361US2024408320A1Injection needle apparatus with safe-protection functionYU SHAN PU·Filed 2023·Application pending·0 cites
- 1446US7545039B2Structure for reducing stress for vias and fabricating method thereofIND TECH RES INST·Filed 2006·Granted Jun 9, 2009·0 cites·5 claims
- 1544US2006220212A1Stacked package for electronic elementsCHEN SHOU-LUNG·Filed 2006·Application pending·0 cites
- 1644US2007036952A1Method And Device For Enhancing SolderabilityIND TECH RES INST·Filed 2006·Application pending·0 cites
- 1743US2009050470A1Method And Device For Enhancing SolderabilityIND TECH RES INST·Filed 2008·Application pending·0 cites
- 1837US2005236684A1Image sensor packaging structure and methodTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 1936US9601474B2Electrically stackable semiconductor wafer and chip packagesINVENSAS CORP·Filed 2015·Granted Mar 21, 2017·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →