Inventor · disambiguated record
Shiyu Yue
Also filed as: YUE SHIYU
4 granted patents·12 pending applications·0 citations·filing 2021–2025
52Inventor score
Files withAPPLIED MATERIALS INC16
Top patents by PatentIndex Score
16 records- 0168US2023343645A1Gradient oxidation and etch of pvd molybdenum for bottom up gap fillAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0265US2023343643A1Gradient oxidation and etch for pvd metal as bottom liner in bottom up gap fillAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 0359US12112890B2Top magnets for decreased non-uniformity in PVDAPPLIED MATERIALS INC·Filed 2021·Granted Oct 8, 2024·0 cites·19 claims
- 0459US2025157856A1Low-temperature molybdenum capping processesAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0558US12394619B2Metal oxide preclean for bottom-up gapfill in MEOL and BEOLAPPLIED MATERIALS INC·Filed 2023·Granted Aug 19, 2025·0 cites·13 claims
- 0656US12374568B2One chamber multi-station selective metal removalAPPLIED MATERIALS INC·Filed 2023·Granted Jul 29, 2025·0 cites·20 claims
- 0756US2025006518A1Bottom etch process for contact plug anchoringAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0855US2024047267A1Tungsten gap fill with hydrogen plasma treatmentAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0954US2024014072A1Nitrogen plasma treatment for bottom-up growthAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1054US2025336722A1Flux gradient molybdenum growth processAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1153US2023420295A1Treatment of tungsten surface for tungsten gap-fillAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1252US12406884B2Self field-suppression CVD tungsten (W) fill on PVD W linerAPPLIED MATERIALS INC·Filed 2022·Granted Sep 2, 2025·0 cites·12 claims
- 1352US2024167148A1Methods of removing metal oxide using cleaning plasmaAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1452US2024355673A1Hybrid molybdenum fill scheme for low resistivity semiconductor applicationsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1549US2025266296A1Integrated methods of manufacturing logic devices and memory devicesAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1647US2023323543A1Integrated cleaning and selective molybdenum deposition processesAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →