Inventor · disambiguated record
Sheng Zhang
Also filed as: ZHANG SHENG · Zhang sheng yu
18 granted patents·4 pending applications·36 citations·filing 2007–2023
89Inventor score
Files withUNITED MICROELECTRONICS CORP12NANCHANG O FILM TECH CO LTD6SHINE OPTOELECTRONICS KUNSHAN CO LTD2CITIC DICASTAL CO LTD1TENCENT TECH SHENZHEN CO LTD1
Top patents by PatentIndex Score
22 records- 0192US10580823B2Wafer level packaging methodUNITED MICROELECTRONICS CORP·Filed 2017·Granted Mar 3, 2020·21 cites·19 claims
- 0289US10823544B2Height difference gaugeCITIC DICASTAL CO LTD·Filed 2019·Granted Nov 3, 2020·6 cites·2 claims
- 0380US9780101B1Flash cell structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Oct 3, 2017·5 cites·18 claims
- 0473US12266578B2Chips bonding auxiliary structureUNITED MICROELECTRONICS CORP·Filed 2022·Granted Apr 1, 2025·0 cites·8 claims
- 0573US9521746B2Conductive film and preparation method thereofNANCHANG O FILM TECH CO LTD·Filed 2013·Granted Dec 13, 2016·1 cites·17 claims
- 0672US9852912B1Method of manufacturing semiconductor device for reducing grain size of polysiliconUNITED MICROELECTRONICS CORP·Filed 2016·Granted Dec 26, 2017·2 cites·17 claims
- 0770US12249607B2Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2023·Granted Mar 11, 2025·0 cites·6 claims
- 0866US11456221B2Method for measuring chips bonding strength and chips bonding auxiliary structureUNITED MICROELECTRONICS CORP·Filed 2020·Granted Sep 27, 2022·0 cites·12 claims
- 0963US11605648B2Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Granted Mar 14, 2023·0 cites·9 claims
- 1061US9445502B2Flexible circuit connecting deviceNANCHANG O FILM TECH CO LTD·Filed 2013·Granted Sep 13, 2016·1 cites·9 claims
- 1158US12278210B2Manufacturing method of semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2022·Granted Apr 15, 2025·0 cites·12 claims
- 1253US11300717B2Optical film and cover plate for electronic deviceSHINE OPTOELECTRONICS KUNSHAN CO LTD·Filed 2018·Granted Apr 12, 2022·0 cites·15 claims
- 1352US12419081B2Silicon-on-insulator substrate and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Sep 16, 2025·0 cites·4 claims
- 1452US9392700B2Transparent conductive film and preparation method thereofNANCHANG O FILM TECH CO LTD·Filed 2013·Granted Jul 12, 2016·0 cites·10 claims
- 1545US9751104B2Apparatus for substrate double-surface hole-fillingNANCHANG O FILM TECH CO LTD·Filed 2013·Granted Sep 5, 2017·0 cites·6 claims
- 1645US9640294B2Single-layer multi-point touch-control conductive filmNANCHANG O FILM TECH CO LTD·Filed 2014·Granted May 2, 2017·0 cites·15 claims
- 1744US10622253B2Manufacturing method of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 14, 2020·0 cites·15 claims
- 1844US2022216134A1Air bridge structure and manufacturing method thereof, and superconducting quantum chip and manufacturing method thereofTENCENT TECH SHENZHEN CO LTD·Filed 2022·Application pending·0 cites
- 1943US11443873B2Conductive film and manufacturing method thereofSHINE OPTOELECTRONICS KUNSHAN CO LTD·Filed 2019·Granted Sep 13, 2022·0 cites·13 claims
- 2043US2014198264A1Metal mesh conductive layer and touch panel having the sameNANCHANG O FILM TECH CO LTD·Filed 2012·Application pending·0 cites
- 2140US2014342473A1Semiconductor processing methodUNITED MICROELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 2238US2008261384A1Method of removing photoresist layer and method of fabricating semiconductor device using the sameUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →