Inventor · disambiguated record
Silvia Kronmueller
Also filed as: KRONMUELLER SILVIA
27 granted patents·4 pending applications·425 citations·filing 2002–2013
96Inventor score
Top patents by PatentIndex Score
31 records- 0198US6936491B2Method of fabricating microelectromechanical systems and devices having trench isolated contactsBOSCH GMBH ROBERT·Filed 2003·Granted Aug 30, 2005·167 cites·27 claims
- 0295US7075160B2Microelectromechanical systems and devices having thin film encapsulated mechanical structuresBOSCH GMBH ROBERT·Filed 2003·Granted Jul 11, 2006·65 cites·43 claims
- 0393US7352040B2Microelectromechanical systems having trench isolated contacts, and methods for fabricating sameBOSCH GMBH ROBERT·Filed 2005·Granted Apr 1, 2008·28 cites·21 claims
- 0492US7288824B2Microelectromechanical systems, and devices having thin film encapsulated mechanical structuresBOSCH GMBH ROBERT·Filed 2005·Granted Oct 30, 2007·15 cites·4 claims
- 0590US7859067B2Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed and methods for fabricating sameBOSCH GMBH ROBERT·Filed 2007·Granted Dec 28, 2010·11 cites·42 claims
- 0690US7317233B2Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating sameBOSCH GMBH ROBERT·Filed 2005·Granted Jan 8, 2008·15 cites·34 claims
- 0790US6952041B2Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating sameBOSCH GMBH ROBERT·Filed 2003·Granted Oct 4, 2005·42 cites·48 claims
- 0888US7579206B2Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating sameBOSCH GMBH ROBERT·Filed 2008·Granted Aug 25, 2009·14 cites·31 claims
- 0984US7834409B2Micromechanical component and corresponding method for its manufactureBOSCH GMBH ROBERT·Filed 2006·Granted Nov 16, 2010·14 cites·10 claims
- 1080US7898046B2Microelectromechanical systems encapsulation processBOSCH GMBH ROBERT·Filed 2009·Granted Mar 1, 2011·5 cites·6 claims
- 1180US7582514B2Microelectromechanical systems encapsulation process with anti-stiction coatingBOSCH GMBH ROBERT·Filed 2007·Granted Sep 1, 2009·9 cites·27 claims
- 1279US7563633B2Microelectromechanical systems encapsulation processBOSCH GMBH ROBERT·Filed 2006·Granted Jul 21, 2009·5 cites·21 claims
- 1375US8329555B2Method for producing a capping wafer for a sensorREICHENBACH FRANK·Filed 2008·Granted Dec 11, 2012·6 cites·6 claims
- 1472US8421167B2Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating samePARTRIDGE AARON·Filed 2010·Granted Apr 16, 2013·1 cites·33 claims
- 1569US8182707B2Method for etching a layer on a substrateLAERMER FRANZ·Filed 2005·Granted May 22, 2012·3 cites·24 claims
- 1667US7851248B2Method for producing a micromechanical component having a thin-layer cappingBOSCH GMBH ROBERT·Filed 2007·Granted Dec 14, 2010·3 cites·10 claims
- 1766US7514283B2Method of fabricating electromechanical device having a controlled atmosphereBOSCH GMBH ROBERT·Filed 2003·Granted Apr 7, 2009·10 cites·32 claims
- 1861US7625603B2Crack and residue free conformal deposited silicon oxide with predictable and uniform etching characteristicsBOSCH GMBH ROBERT·Filed 2003·Granted Dec 1, 2009·6 cites·24 claims
- 1959US8623686B2Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating samePARTRIDGE AARON·Filed 2013·Granted Jan 7, 2014·0 cites·12 claims
- 2059US8018077B2Electromechanical system having a controlled atmosphere, and method of fabricating sameBOSCH GMBH ROBERT·Filed 2009·Granted Sep 13, 2011·0 cites·13 claims
- 2156US8287956B2Crack and residue free conformal deposited silicon oxide with predictable and uniform etching characteristicsPARTRIDGE AARON·Filed 2009·Granted Oct 16, 2012·0 cites·14 claims
- 2254US9771257B2Electromechanical system having a controlled atmosphere, and method of fabricating samePARTRIDGE AARON·Filed 2011·Granted Sep 26, 2017·0 cites·17 claims
- 2354US7270868B2Micromechanical componentBOSCH GMBH ROBERT·Filed 2003·Granted Sep 18, 2007·5 cites·10 claims
- 2452US8148234B2Method for manufacturing a semiconductor structure, and a corresponding Semiconductor StructureLAMMEL GERHARD·Filed 2007·Granted Apr 3, 2012·0 cites·12 claims
- 2550US8492850B2Method for producing a silicon substrate having modified surface properties and a silicon substrate of said typeLAMMEL GERHARD·Filed 2007·Granted Jul 23, 2013·0 cites·5 claims
- 2648US2013061674A1Method for producing a capping wafer for a sensorBOSCH GMBH ROBERT·Filed 2012·Application pending·0 cites
- 2747US2012132925A1Method for manufacturing a semiconductor structure, and a corresponding semiconductor structureLAMMEL GERHARD·Filed 2012·Application pending·0 cites
- 2845US9035413B2Semiconductor device with embedded converter element and production method for a semiconductor device with an embedded converter elementBOSCH GMBH ROBERT·Filed 2013·Granted May 19, 2015·0 cites·16 claims
- 2944US2010127339A1Micromechanical component having an anti-adhesive layerLAERMER FRANZ·Filed 2007·Application pending·0 cites
- 3043US7382031B2Component including a fixed element that is in a silicon layer and is mechanically connected to a substrate via an anchoring element and method for its manufactureBOSCH GMBH ROBERT·Filed 2002·Granted Jun 3, 2008·1 cites·26 claims
- 3137US2005054134A1Method for manufacturing a microsystemFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →