Inventor · disambiguated record
Sinjae Lee
Also filed as: LEE SINJAE
12 granted patents·155 citations·filing 2008–2022
91Inventor score
Top patents by PatentIndex Score
12 records- 0193US8343810B2Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layersSTATS CHIPPAC LTD·Filed 2010·Granted Jan 1, 2013·18 cites·30 claims
- 0293US8004093B2Integrated circuit package stacking systemSTATS CHIPPAC LTD·Filed 2008·Granted Aug 23, 2011·37 cites·18 claims
- 0392US8836114B2Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layersSTATS CHIPPAC LTD·Filed 2012·Granted Sep 16, 2014·15 cites·31 claims
- 0492US8003496B2Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the dieSTATS CHIPPAC LTD·Filed 2009·Granted Aug 23, 2011·22 cites·21 claims
- 0592US7683469B2Package-on-package system with heat spreaderSTATS CHIPPAC LTD·Filed 2008·Granted Mar 23, 2010·32 cites·20 claims
- 0687US9401347B2Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSVSTATS CHIPPAC LTD·Filed 2015·Granted Jul 26, 2016·5 cites·24 claims
- 0786US8531012B2Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSVLEE SINJAE·Filed 2009·Granted Sep 10, 2013·13 cites·22 claims
- 0885US9379064B2Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the dieSTATS CHIPPAC LTD·Filed 2015·Granted Jun 28, 2016·4 cites·25 claims
- 0974US9048209B2Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the dieOH JIHOON·Filed 2011·Granted Jun 2, 2015·4 cites·28 claims
- 1072US8937371B2Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSVSTATS CHIPPAC LTD·Filed 2013·Granted Jan 20, 2015·2 cites·24 claims
- 1169US8569870B1Integrated circuit packaging system with shielding spacer and method of manufacture thereofLEE SINJAE·Filed 2012·Granted Oct 29, 2013·3 cites·10 claims
- 1264US12511803B2Apparatus for applying graphic effect and method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →