Inventor · disambiguated record
Siu Waf Low
Also filed as: LOW SIU W · LOW SIU WAF
31 granted patents·1 pending application·1,740 citations·filing 1992–2009
98Inventor score
Top patents by PatentIndex Score
32 records- 0198US7485562B2Method of making multichip wafer level packages and computing systems incorporating sameMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 3, 2009·141 cites·18 claims
- 0297US6882021B2Packaged image sensing microelectronic devices including a lead and methods of packaging image sensing microelectronic devices including a leadMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 19, 2005·157 cites·38 claims
- 0396US7193312B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 20, 2007·32 cites·13 claims
- 0495US6137164AThin stacked integrated circuit deviceTEXAS INSTRUMENTS INC·Filed 1999·Granted Oct 24, 2000·326 cites·10 claims
- 0595US5952611AFlexible pin location integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1997·Granted Sep 14, 1999·216 cites·19 claims
- 0694US7633159B2Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packagesMICRON TECHNOLOGY INC·Filed 2005·Granted Dec 15, 2009·26 cites·27 claims
- 0793US7208335B2Castellated chip-scale packages and methods for fabricating the sameMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 24, 2007·62 cites·72 claims
- 0893US5461255AMulti-layered lead frame assembly for integrated circuitsTEXAS INSTRUMENTS INC·Filed 1994·Granted Oct 24, 1995·151 cites·7 claims
- 0992US6964881B2Multi-chip wafer level system packages and methods of forming sameMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 15, 2005·51 cites·13 claims
- 1092US6365833B1Integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2000·Granted Apr 2, 2002·70 cites·7 claims
- 1191US7173330B2Multiple chip semiconductor packageMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 6, 2007·17 cites·21 claims
- 1290US6825553B2Multichip wafer level packages and computing systems incorporating sameMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 30, 2004·44 cites·26 claims
- 1389US6387729B2Method for adhering and sealing a silicon chip in an integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2001·Granted May 14, 2002·48 cites·5 claims
- 1487US7274094B2Leadless packaging for image sensor devicesMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 25, 2007·39 cites·24 claims
- 1586US6958537B2Multiple chip semiconductor packageMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 25, 2005·32 cites·18 claims
- 1685US7579681B2Super high density module with integrated wafer level packagesMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 25, 2009·28 cites·21 claims
- 1784US7884007B2Super high density module with integrated wafer level packagesMICRON TECHNOLOGY INC·Filed 2007·Granted Feb 8, 2011·8 cites·22 claims
- 1884US7368374B2Super high density module with integrated wafer level packagesMICRON TECHNOLOGY INC·Filed 2004·Granted May 6, 2008·24 cites·36 claims
- 1984US6987031B2Multiple chip semiconductor package and method of fabricating sameMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 17, 2006·27 cites·32 claims
- 2083US8063493B2Semiconductor device assemblies and packagesBOON SUAN JEUNG·Filed 2009·Granted Nov 22, 2011·9 cites·20 claims
- 2182US7087992B2Multichip wafer level packages and computing systems incorporating sameMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 8, 2006·21 cites·25 claims
- 2281US7112471B2Leadless packaging for image sensor devices and methods of assemblyMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 26, 2006·27 cites·26 claims
- 2381US5331200ALead-on-chip inner lead bonding lead frame method and apparatusTEXAS INSTRUMENTS INC·Filed 1992·Granted Jul 19, 1994·81 cites·7 claims
- 2479US8304894B2Super high-density module with integrated wafer level packagesCHIA YONG POO·Filed 2007·Granted Nov 6, 2012·6 cites·31 claims
- 2579US7304375B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Dec 4, 2007·5 cites·12 claims
- 2679US6087203AMethod for adhering and sealing a silicon chip in an integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1997·Granted Jul 11, 2000·45 cites·8 claims
- 2769US7271027B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 18, 2007·2 cites·18 claims
- 2867US8698295B2Super high-density module with integrated wafer level packagesCHIA YONG POO·Filed 2007·Granted Apr 15, 2014·2 cites·20 claims
- 2967US6236107B1Encapsulate resin LOC package and method of fabricationTEXAS INSTRUMENTS INC·Filed 1995·Granted May 22, 2001·33 cites·12 claims
- 3062US7553697B2Multiple chip semiconductor packageMICRON TECHNOLOGY INC·Filed 2006·Granted Jun 30, 2009·1 cites·16 claims
- 3159US6856155B2Methods and apparatus for testing and burn-in of semiconductor devicesMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 15, 2005·9 cites·28 claims
- 3243US2004229400A1Multichip wafer level system packages and methods of forming sameFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →