Inventor · disambiguated record
Siriwanna Ounkaew
Also filed as: OUNKAEW SIRIWANNA
4 granted patents·1 pending application·7 citations·filing 2016–2022
63Inventor score
Top patents by PatentIndex Score
5 records- 0185US10242953B1Semiconductor package with plated metal shielding and a method thereofUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted Mar 26, 2019·7 cites·20 claims
- 0256US12489078B2Semiconductor device and method of disposing electrical components above and below substrateUTAC HEADQUARTERS PTE LTD·Filed 2022·Granted Dec 2, 2025·0 cites·20 claims
- 0352US10600741B1Semiconductor package with plated metal shielding and a method thereofUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Mar 24, 2020·0 cites·18 claims
- 0438US2021202339A1Reliable semiconductor packagesUTAC HEADQUARTERS PTE LTD·Filed 2020·Application pending·0 cites
- 0534US10759904B2Method for preparing poly(carbonate-etherimide) compoundPTT GLOBAL CHEMICAL PUBLIC CO LTD·Filed 2016·Granted Sep 1, 2020·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →